JPS55145724A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS55145724A
JPS55145724A JP5404879A JP5404879A JPS55145724A JP S55145724 A JPS55145724 A JP S55145724A JP 5404879 A JP5404879 A JP 5404879A JP 5404879 A JP5404879 A JP 5404879A JP S55145724 A JPS55145724 A JP S55145724A
Authority
JP
Japan
Prior art keywords
compound
epoxy resin
heat
maleimide
resistant resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5404879A
Other languages
Japanese (ja)
Inventor
Shiyuichi Suzuki
Sadao Kajiura
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5404879A priority Critical patent/JPS55145724A/en
Publication of JPS55145724A publication Critical patent/JPS55145724A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide a heat-resistant resin with improved cure-promoting effect and excellent mechanical strength by a method wherein a silane compound having hydroxyl group or a polysiloxane compound is added to a mixture of a maleimide compound, an epoxy resin, and an alumium compound.
CONSTITUTION: (A) A maleimide compound, (B) an epoxy resin, (C) a 0.0001W 5wt% aluminum compound as a curing catalyst and (D) a 0.0001W5wt% silane compound having hydroxyl group or a polysiloxane compound are mixed as curing catalyst. Moreover, a radical-polymerization initiator such as benzoyl peroxide, or dicumyl peroxide used accrding to necessity is appropriately selected corresponding to the molding condition, a usage condition and purpose. Moreover, in order to enhance the compatibility among a maleimide compound, an epoxy resin and a silane compound or a polysiloxyane compound, or furfuryl alcohol may be added according to necessity.
COPYRIGHT: (C)1980,JPO&Japio
JP5404879A 1979-05-04 1979-05-04 Heat-resistant resin composition Pending JPS55145724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5404879A JPS55145724A (en) 1979-05-04 1979-05-04 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5404879A JPS55145724A (en) 1979-05-04 1979-05-04 Heat-resistant resin composition

Publications (1)

Publication Number Publication Date
JPS55145724A true JPS55145724A (en) 1980-11-13

Family

ID=12959713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5404879A Pending JPS55145724A (en) 1979-05-04 1979-05-04 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS55145724A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
JPS61291621A (en) * 1985-06-19 1986-12-22 Three Bond Co Ltd Curable composition
JPH0481424A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Resin composition for sealing
JPH0481423A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Epoxy resin composition for sealing
JP2012149155A (en) * 2011-01-18 2012-08-09 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
JPS61291621A (en) * 1985-06-19 1986-12-22 Three Bond Co Ltd Curable composition
JPH0481424A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Resin composition for sealing
JPH0481423A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Epoxy resin composition for sealing
JP2012149155A (en) * 2011-01-18 2012-08-09 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same

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