JPS55145724A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS55145724A JPS55145724A JP5404879A JP5404879A JPS55145724A JP S55145724 A JPS55145724 A JP S55145724A JP 5404879 A JP5404879 A JP 5404879A JP 5404879 A JP5404879 A JP 5404879A JP S55145724 A JPS55145724 A JP S55145724A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- epoxy resin
- heat
- maleimide
- resistant resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To provide a heat-resistant resin with improved cure-promoting effect and excellent mechanical strength by a method wherein a silane compound having hydroxyl group or a polysiloxane compound is added to a mixture of a maleimide compound, an epoxy resin, and an alumium compound.
CONSTITUTION: (A) A maleimide compound, (B) an epoxy resin, (C) a 0.0001W 5wt% aluminum compound as a curing catalyst and (D) a 0.0001W5wt% silane compound having hydroxyl group or a polysiloxane compound are mixed as curing catalyst. Moreover, a radical-polymerization initiator such as benzoyl peroxide, or dicumyl peroxide used accrding to necessity is appropriately selected corresponding to the molding condition, a usage condition and purpose. Moreover, in order to enhance the compatibility among a maleimide compound, an epoxy resin and a silane compound or a polysiloxyane compound, or furfuryl alcohol may be added according to necessity.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5404879A JPS55145724A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5404879A JPS55145724A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55145724A true JPS55145724A (en) | 1980-11-13 |
Family
ID=12959713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5404879A Pending JPS55145724A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55145724A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
JPS61291621A (en) * | 1985-06-19 | 1986-12-22 | Three Bond Co Ltd | Curable composition |
JPH0481424A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Resin composition for sealing |
JPH0481423A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing |
JP2012149155A (en) * | 2011-01-18 | 2012-08-09 | Hitachi Chemical Co Ltd | Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same |
-
1979
- 1979-05-04 JP JP5404879A patent/JPS55145724A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
JPS61291621A (en) * | 1985-06-19 | 1986-12-22 | Three Bond Co Ltd | Curable composition |
JPH0481424A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Resin composition for sealing |
JPH0481423A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing |
JP2012149155A (en) * | 2011-01-18 | 2012-08-09 | Hitachi Chemical Co Ltd | Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS564625A (en) | Epoxy resin composition | |
JPS55145724A (en) | Heat-resistant resin composition | |
JPS5690827A (en) | Heat-resistant resin composition | |
JPS5562963A (en) | Photo-setting organopolysiloxane composition | |
JPS55145725A (en) | Heat-resistant resin composition | |
JPS5742724A (en) | Curable composition | |
JPS5388097A (en) | Epoxy resin composition | |
JPS55145727A (en) | Elastomer composition containing epoxy group | |
JPS5772750A (en) | Binder composition for mold | |
JPS5562978A (en) | Motor vehicle surface-protecting agent composition | |
JPS5730719A (en) | Preparation of cured novolak type epoxy resin | |
JPS54111536A (en) | Heat resistant heat-sealing agent | |
JPS5548229A (en) | Modifier for composite material | |
JPS55133438A (en) | Polyolefin resin composition | |
JPS57125230A (en) | Rubber composition | |
JPS55116721A (en) | Molding composition | |
JPS5650958A (en) | Resin composition | |
JPS562311A (en) | Curable resin composition | |
JPS57174314A (en) | Epoxy resin composition | |
JPS5790012A (en) | Heat-resistant resin composition | |
JPS5494600A (en) | Production of heat-resistant epoxy resin | |
JPS5566953A (en) | Composition for continuously porous silicone rubber molded article | |
JPS54152100A (en) | Epoxy resin composition | |
JPS5796030A (en) | Inorganic filler composition for polymer | |
JPS5757711A (en) | Resin composition for low-pressure molding |