US4498046A
(en)
*
|
1982-10-18 |
1985-02-05 |
International Business Machines Corporation |
Room temperature cryogenic test interface
|
US4495479A
(en)
*
|
1982-10-22 |
1985-01-22 |
International Business Machines Corporation |
Selective wiring for multilayer printed circuit board
|
US4860166A
(en)
*
|
1983-09-06 |
1989-08-22 |
Raytheon Company |
Integrated circuit termination device
|
US4597029A
(en)
*
|
1984-03-19 |
1986-06-24 |
Trilogy Computer Development Partners, Ltd. |
Signal connection system for semiconductor chip
|
US4754371A
(en)
*
|
1984-04-27 |
1988-06-28 |
Nec Corporation |
Large scale integrated circuit package
|
US4536328A
(en)
*
|
1984-05-30 |
1985-08-20 |
Heraeus Cermalloy, Inc. |
Electrical resistance compositions and methods of making the same
|
JPS6156493A
(ja)
*
|
1984-08-28 |
1986-03-22 |
日本電気株式会社 |
多層回路基板の電源配線構造
|
JPS6273799A
(ja)
*
|
1985-09-27 |
1987-04-04 |
日本電気株式会社 |
多層セラミツク配線基板
|
JPS62265796A
(ja)
*
|
1986-05-14 |
1987-11-18 |
株式会社住友金属セラミックス |
セラミツク多層配線基板およびその製造法
|
US4945399A
(en)
*
|
1986-09-30 |
1990-07-31 |
International Business Machines Corporation |
Electronic package with integrated distributed decoupling capacitors
|
US4744008A
(en)
*
|
1986-11-18 |
1988-05-10 |
International Business Machines Corporation |
Flexible film chip carrier with decoupling capacitors
|
US5016085A
(en)
*
|
1988-03-04 |
1991-05-14 |
Hughes Aircraft Company |
Hermetic package for integrated circuit chips
|
US4967314A
(en)
*
|
1988-03-28 |
1990-10-30 |
Prime Computer Inc. |
Circuit board construction
|
KR930010076B1
(ko)
*
|
1989-01-14 |
1993-10-14 |
티디케이 가부시키가이샤 |
다층혼성집적회로
|
MY105486A
(en)
*
|
1989-12-15 |
1994-10-31 |
Tdk Corp |
A multilayer hybrid circuit.
|
JP2767645B2
(ja)
*
|
1990-03-07 |
1998-06-18 |
富士通株式会社 |
多層配線基板の製造方法
|
US5027253A
(en)
*
|
1990-04-09 |
1991-06-25 |
Ibm Corporation |
Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
|
EP0496491A1
(en)
*
|
1991-01-22 |
1992-07-29 |
National Semiconductor Corporation |
Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same
|
US5473120A
(en)
*
|
1992-04-27 |
1995-12-05 |
Tokuyama Corporation |
Multilayer board and fabrication method thereof
|
US5396397A
(en)
*
|
1992-09-24 |
1995-03-07 |
Hughes Aircraft Company |
Field control and stability enhancement in multi-layer, 3-dimensional structures
|
JP3520540B2
(ja)
*
|
1993-12-07 |
2004-04-19 |
株式会社デンソー |
多層基板
|
JP3684239B2
(ja)
|
1995-01-10 |
2005-08-17 |
株式会社 日立製作所 |
低emi電子機器
|
US6177964B1
(en)
*
|
1997-08-01 |
2001-01-23 |
Microtune, Inc. |
Broadband integrated television tuner
|
US5737035A
(en)
*
|
1995-04-21 |
1998-04-07 |
Microtune, Inc. |
Highly integrated television tuner on a single microcircuit
|
US5889462A
(en)
*
|
1996-04-08 |
1999-03-30 |
Bourns, Inc. |
Multilayer thick film surge resistor network
|
US6331680B1
(en)
*
|
1996-08-07 |
2001-12-18 |
Visteon Global Technologies, Inc. |
Multilayer electrical interconnection device and method of making same
|
FR2755569B1
(fr)
*
|
1996-11-04 |
1999-01-08 |
Fihem |
Equipement de telecommunication filaire avec protection contre des parasites electromagnetiques
|
US9054094B2
(en)
|
1997-04-08 |
2015-06-09 |
X2Y Attenuators, Llc |
Energy conditioning circuit arrangement for integrated circuit
|
US7336468B2
(en)
|
1997-04-08 |
2008-02-26 |
X2Y Attenuators, Llc |
Arrangement for energy conditioning
|
US7321485B2
(en)
|
1997-04-08 |
2008-01-22 |
X2Y Attenuators, Llc |
Arrangement for energy conditioning
|
US6171921B1
(en)
*
|
1998-06-05 |
2001-01-09 |
Motorola, Inc. |
Method for forming a thick-film resistor and thick-film resistor formed thereby
|
DE69920273T2
(de)
*
|
1998-11-12 |
2005-09-22 |
Broadcom Corp., Irvine |
Integrierte tunerarchitektur
|
JP4680410B2
(ja)
*
|
2001-04-24 |
2011-05-11 |
日本特殊陶業株式会社 |
配線基板
|
US6504111B2
(en)
*
|
2001-05-29 |
2003-01-07 |
International Business Machines Corporation |
Solid via layer to layer interconnect
|
US6982387B2
(en)
*
|
2001-06-19 |
2006-01-03 |
International Business Machines Corporation |
Method and apparatus to establish circuit layers interconnections
|
US6495912B1
(en)
*
|
2001-09-17 |
2002-12-17 |
Megic Corporation |
Structure of ceramic package with integrated passive devices
|
US20050029011A1
(en)
*
|
2003-08-07 |
2005-02-10 |
Matsushita Electric Industrial Co., Ltd. |
Circuit board
|
US8569142B2
(en)
*
|
2003-11-28 |
2013-10-29 |
Blackberry Limited |
Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
|
US7216406B2
(en)
*
|
2004-09-29 |
2007-05-15 |
Intel Corporation |
Method forming split thin film capacitors with multiple voltages
|
US7227266B2
(en)
|
2004-11-09 |
2007-06-05 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Interconnect structure to reduce stress induced voiding effect
|
JP2008535207A
(ja)
|
2005-03-01 |
2008-08-28 |
エックストゥーワイ アテニュエイターズ,エルエルシー |
共平面導体を有する調整器
|
US20080135282A1
(en)
*
|
2006-12-11 |
2008-06-12 |
Motorola, Inc. |
Printed multilayer circuit containing active devices and method of manufaturing
|
US11476566B2
(en)
|
2009-03-09 |
2022-10-18 |
Nucurrent, Inc. |
Multi-layer-multi-turn structure for high efficiency wireless communication
|
US9232893B2
(en)
|
2009-03-09 |
2016-01-12 |
Nucurrent, Inc. |
Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication
|
US9439287B2
(en)
|
2009-03-09 |
2016-09-06 |
Nucurrent, Inc. |
Multi-layer wire structure for high efficiency wireless communication
|
EP4234001A3
(en)
|
2009-03-09 |
2023-10-18 |
NuCurrent, Inc. |
System and method for wireless power transfer in implantable medical devices
|
US9300046B2
(en)
|
2009-03-09 |
2016-03-29 |
Nucurrent, Inc. |
Method for manufacture of multi-layer-multi-turn high efficiency inductors
|
US9208942B2
(en)
|
2009-03-09 |
2015-12-08 |
Nucurrent, Inc. |
Multi-layer-multi-turn structure for high efficiency wireless communication
|
US9306358B2
(en)
|
2009-03-09 |
2016-04-05 |
Nucurrent, Inc. |
Method for manufacture of multi-layer wire structure for high efficiency wireless communication
|
US9444213B2
(en)
|
2009-03-09 |
2016-09-13 |
Nucurrent, Inc. |
Method for manufacture of multi-layer wire structure for high efficiency wireless communication
|
US9324718B2
(en)
|
2010-01-29 |
2016-04-26 |
Hewlett Packard Enterprise Development Lp |
Three dimensional multilayer circuit
|
US7982504B1
(en)
|
2010-01-29 |
2011-07-19 |
Hewlett Packard Development Company, L.P. |
Interconnection architecture for multilayer circuits
|
US9464151B2
(en)
|
2011-04-28 |
2016-10-11 |
Isp Investments Llc |
Lactamic polymer containing an acetoacetate moiety
|
US20130068499A1
(en)
*
|
2011-09-15 |
2013-03-21 |
Nucurrent Inc. |
Method for Operation of Multi-Layer Wire Structure for High Efficiency Wireless Communication
|
US10063100B2
(en)
|
2015-08-07 |
2018-08-28 |
Nucurrent, Inc. |
Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling
|
US9941590B2
(en)
|
2015-08-07 |
2018-04-10 |
Nucurrent, Inc. |
Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding
|
US10658847B2
(en)
|
2015-08-07 |
2020-05-19 |
Nucurrent, Inc. |
Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling
|
US9960628B2
(en)
|
2015-08-07 |
2018-05-01 |
Nucurrent, Inc. |
Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling
|
US11205848B2
(en)
|
2015-08-07 |
2021-12-21 |
Nucurrent, Inc. |
Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
|
US9948129B2
(en)
|
2015-08-07 |
2018-04-17 |
Nucurrent, Inc. |
Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit
|
US10636563B2
(en)
|
2015-08-07 |
2020-04-28 |
Nucurrent, Inc. |
Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
|
US9960629B2
(en)
|
2015-08-07 |
2018-05-01 |
Nucurrent, Inc. |
Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
|
US9941729B2
(en)
|
2015-08-07 |
2018-04-10 |
Nucurrent, Inc. |
Single layer multi mode antenna for wireless power transmission using magnetic field coupling
|
US9941743B2
(en)
|
2015-08-07 |
2018-04-10 |
Nucurrent, Inc. |
Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
|
US10985465B2
(en)
|
2015-08-19 |
2021-04-20 |
Nucurrent, Inc. |
Multi-mode wireless antenna configurations
|
US10879704B2
(en)
|
2016-08-26 |
2020-12-29 |
Nucurrent, Inc. |
Wireless connector receiver module
|
WO2018107037A1
(en)
|
2016-12-09 |
2018-06-14 |
Nucurrent, Inc. |
A substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
|
US11223235B2
(en)
|
2017-02-13 |
2022-01-11 |
Nucurrent, Inc. |
Wireless electrical energy transmission system
|
US11277028B2
(en)
|
2017-05-26 |
2022-03-15 |
Nucurrent, Inc. |
Wireless electrical energy transmission system for flexible device orientation
|
US11271430B2
(en)
|
2019-07-19 |
2022-03-08 |
Nucurrent, Inc. |
Wireless power transfer system with extended wireless charging range
|
US11227712B2
(en)
|
2019-07-19 |
2022-01-18 |
Nucurrent, Inc. |
Preemptive thermal mitigation for wireless power systems
|
US11056922B1
(en)
|
2020-01-03 |
2021-07-06 |
Nucurrent, Inc. |
Wireless power transfer system for simultaneous transfer to multiple devices
|
US11283303B2
(en)
|
2020-07-24 |
2022-03-22 |
Nucurrent, Inc. |
Area-apportioned wireless power antenna for maximized charging volume
|
US11876386B2
(en)
|
2020-12-22 |
2024-01-16 |
Nucurrent, Inc. |
Detection of foreign objects in large charging volume applications
|
US11881716B2
(en)
|
2020-12-22 |
2024-01-23 |
Nucurrent, Inc. |
Ruggedized communication for wireless power systems in multi-device environments
|
US11695302B2
(en)
|
2021-02-01 |
2023-07-04 |
Nucurrent, Inc. |
Segmented shielding for wide area wireless power transmitter
|
US11831174B2
(en)
|
2022-03-01 |
2023-11-28 |
Nucurrent, Inc. |
Cross talk and interference mitigation in dual wireless power transmitter
|