JPS55125297A - Regulating apparatus for condition of plating bath - Google Patents

Regulating apparatus for condition of plating bath

Info

Publication number
JPS55125297A
JPS55125297A JP3103579A JP3103579A JPS55125297A JP S55125297 A JPS55125297 A JP S55125297A JP 3103579 A JP3103579 A JP 3103579A JP 3103579 A JP3103579 A JP 3103579A JP S55125297 A JPS55125297 A JP S55125297A
Authority
JP
Japan
Prior art keywords
plating bath
condition
plating
vessel
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3103579A
Other languages
Japanese (ja)
Inventor
Nobuyoshi Terasaki
Tetsuo Sawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3103579A priority Critical patent/JPS55125297A/en
Publication of JPS55125297A publication Critical patent/JPS55125297A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: Regulating apparatus for the condition of plating bath, simplyfied the plating treatment vessel and improved workability and efficiency, by providing the auxiliary vessel in plating bath circulation path and also, providing measuring means of plating bath condition in the above vessel concentratedly.
CONSTITUTION: Plating bath overflowed from the plating treatment bath 2, is flowed in the auxiliary vessel 4 and is returned to the bath 2 heated desired temperature at the heat exchanging apparatus 3e after purifying by removing inpurities at the filtration apparatus 3b. Changes of plating bath condition, for example, quantitative changes of copper sulfate, sulfuric acid and moisture, are detected by using the specific gravity sensor 7, the pH sensor 8, the temperature sensor 9 and the level sensor 10. Then, outputs from the above sensors are sent to the concentration measuring control board and when the discrepancy is occurred between measured plating bath conditions and desired plating bath condition, controlling is carried out so as to be eliminated the above discrepancy.
COPYRIGHT: (C)1980,JPO&Japio
JP3103579A 1979-03-19 1979-03-19 Regulating apparatus for condition of plating bath Pending JPS55125297A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3103579A JPS55125297A (en) 1979-03-19 1979-03-19 Regulating apparatus for condition of plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3103579A JPS55125297A (en) 1979-03-19 1979-03-19 Regulating apparatus for condition of plating bath

Publications (1)

Publication Number Publication Date
JPS55125297A true JPS55125297A (en) 1980-09-26

Family

ID=12320239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3103579A Pending JPS55125297A (en) 1979-03-19 1979-03-19 Regulating apparatus for condition of plating bath

Country Status (1)

Country Link
JP (1) JPS55125297A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100478003B1 (en) * 2002-05-30 2005-03-23 김용욱 Apparatus for controlling plating liquid in plating tank
KR100846341B1 (en) 2007-09-27 2008-07-15 대륙금속(주) Bath control apparatus for trivalent chromium plating
CN102756994A (en) * 2011-04-26 2012-10-31 永恒力集团 Ground transportation tool provided with lifting column inclination indicator
CN103469288A (en) * 2013-09-02 2013-12-25 陈文智 Electroplating bath provided with circulating filtration device
JP2020122192A (en) * 2019-01-31 2020-08-13 株式会社ミズタニ産商 Plating solution adjusting apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100478003B1 (en) * 2002-05-30 2005-03-23 김용욱 Apparatus for controlling plating liquid in plating tank
KR100846341B1 (en) 2007-09-27 2008-07-15 대륙금속(주) Bath control apparatus for trivalent chromium plating
CN102756994A (en) * 2011-04-26 2012-10-31 永恒力集团 Ground transportation tool provided with lifting column inclination indicator
CN103469288A (en) * 2013-09-02 2013-12-25 陈文智 Electroplating bath provided with circulating filtration device
JP2020122192A (en) * 2019-01-31 2020-08-13 株式会社ミズタニ産商 Plating solution adjusting apparatus

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