JPS55122176A - Method of molding ats ground unit or the like with resin - Google Patents
Method of molding ats ground unit or the like with resinInfo
- Publication number
- JPS55122176A JPS55122176A JP2962779A JP2962779A JPS55122176A JP S55122176 A JPS55122176 A JP S55122176A JP 2962779 A JP2962779 A JP 2962779A JP 2962779 A JP2962779 A JP 2962779A JP S55122176 A JPS55122176 A JP S55122176A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- resin
- lead wires
- molding
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title abstract 7
- 229920005989 resin Polymers 0.000 title abstract 7
- 238000000465 moulding Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000004299 exfoliation Methods 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
Landscapes
- Train Traffic Observation, Control, And Security (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
PURPOSE: To stably mold an ATS ground unit, by coating a coil with resin to pervent the deformation of the coil, thereafter coupling the coil to a printed circuit board, an outside cable or the like and integrally molding these members with resin.
CONSTITUTION: A coiled wire 3 and lead wires 4 are dipped in a hardener-containing resin except for the ends of the lead wires as the coiled wire 3 and the lead wires 4 are shaped by coil frames 1, 1. A resin-coated coil 5 is thus manufactured. As a result, the coil is not deformed and the resonance frequency, vibration coefficient Q, etc. do not change in a succeeding molding process. A printed circuit board 9 is coupled to the coil 5. The lead wires 8 of the board 9 are connected to an outside cable 15. The oscillation resonance frequency of the coil is adjusted by a resistor, a capacitor or the like on the circuit board 9. These members are integrally shaped with injected resin by a metal mold and a metal mold lid 11. An ATS ground unit of high reliability can thus be molded. The resonance frequency of the unit does not change after the molding. Since the resin is not dividedly injected, secular exfoliation does not occure on the unit.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54029627A JPS6046901B2 (en) | 1979-03-14 | 1979-03-14 | Molding method using resin such as ATS ground element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54029627A JPS6046901B2 (en) | 1979-03-14 | 1979-03-14 | Molding method using resin such as ATS ground element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55122176A true JPS55122176A (en) | 1980-09-19 |
| JPS6046901B2 JPS6046901B2 (en) | 1985-10-18 |
Family
ID=12281318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54029627A Expired JPS6046901B2 (en) | 1979-03-14 | 1979-03-14 | Molding method using resin such as ATS ground element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6046901B2 (en) |
-
1979
- 1979-03-14 JP JP54029627A patent/JPS6046901B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6046901B2 (en) | 1985-10-18 |
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