JPS5511632A - Bonding method between plane diaphragm and edge component - Google Patents

Bonding method between plane diaphragm and edge component

Info

Publication number
JPS5511632A
JPS5511632A JP8404878A JP8404878A JPS5511632A JP S5511632 A JPS5511632 A JP S5511632A JP 8404878 A JP8404878 A JP 8404878A JP 8404878 A JP8404878 A JP 8404878A JP S5511632 A JPS5511632 A JP S5511632A
Authority
JP
Japan
Prior art keywords
diaphragm
face
edge component
bonding
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8404878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6123719B2 (enrdf_load_html_response
Inventor
Mamoru Osato
Nobuhiro Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP8404878A priority Critical patent/JPS5511632A/ja
Publication of JPS5511632A publication Critical patent/JPS5511632A/ja
Publication of JPS6123719B2 publication Critical patent/JPS6123719B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/16Mounting or tensioning of diaphragms or cones
    • H04R7/18Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/20Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
JP8404878A 1978-07-12 1978-07-12 Bonding method between plane diaphragm and edge component Granted JPS5511632A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8404878A JPS5511632A (en) 1978-07-12 1978-07-12 Bonding method between plane diaphragm and edge component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8404878A JPS5511632A (en) 1978-07-12 1978-07-12 Bonding method between plane diaphragm and edge component

Publications (2)

Publication Number Publication Date
JPS5511632A true JPS5511632A (en) 1980-01-26
JPS6123719B2 JPS6123719B2 (enrdf_load_html_response) 1986-06-06

Family

ID=13819607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8404878A Granted JPS5511632A (en) 1978-07-12 1978-07-12 Bonding method between plane diaphragm and edge component

Country Status (1)

Country Link
JP (1) JPS5511632A (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201521U (enrdf_load_html_response) * 1986-06-11 1987-12-22
JPH08316776A (ja) * 1996-03-29 1996-11-29 Murata Mfg Co Ltd 複合電子部品

Also Published As

Publication number Publication date
JPS6123719B2 (enrdf_load_html_response) 1986-06-06

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