JPS55112731A - Electrolytic composite super-finishing method on the external surface of cylinder - Google Patents

Electrolytic composite super-finishing method on the external surface of cylinder

Info

Publication number
JPS55112731A
JPS55112731A JP2091979A JP2091979A JPS55112731A JP S55112731 A JPS55112731 A JP S55112731A JP 2091979 A JP2091979 A JP 2091979A JP 2091979 A JP2091979 A JP 2091979A JP S55112731 A JPS55112731 A JP S55112731A
Authority
JP
Japan
Prior art keywords
workpiece
electrode
action
external surface
concavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2091979A
Other languages
Japanese (ja)
Inventor
Yasuo Kimoto
Katsutsune Tamiya
Shoichi Honda
Hidehiko Maehata
Hiroshi Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen Corp filed Critical Hitachi Zosen Corp
Priority to JP2091979A priority Critical patent/JPS55112731A/en
Priority to US06/123,648 priority patent/US4294673A/en
Priority to DE3006711A priority patent/DE3006711C2/en
Priority to CH148480A priority patent/CH644540A5/en
Publication of JPS55112731A publication Critical patent/JPS55112731A/en
Priority to US06/201,335 priority patent/US4328083A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/04Treating surfaces of rolls

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

PURPOSE:To make it possible to simply and easily attain super-finishing in the order of 0.1mum R max with a roundness degree of several mum, by applying a combined action of electrolytic action and abrasive grinding action together to a cylinder which has previously been machined by an ordinary lathe. CONSTITUTION:A supplying port 4 opening into a concavity 3 of an electrode 1 is provided by forming in a tool electrode 1 the concavity which has a radius somewhat larger than the radius of an anodic cylindrical workpiece 2. Then, an electrolytic action and grinding action with the use of abrasive 5 are put together into a composite action for the purpose of super-finishing the external surface of the workpiece 2 in such a way that the concavity 3 of the electrode 1 is provided oppositely to the workpiece 2 with a clearance between the electrode 1 and the external surface of the workpiece 2, abrasive 5 is interposed between the external surface of the workpiece 2 and the arcuate end face of the electrode 1, electrolytic liquid 6 is supplied from a supplying port 4, the workpiece 2 is rotated in the direction indicated by the longer arrow, the electrode 1 is converted into a cathode, and at the same time, the workpiece 2 is rendered anodic. In other words, even if there is 10-40mum of rotational torsion, it is possible to make a subsequent finishing of a mum order of roundness and 0.05-0.1mum R max of surface smoothness.
JP2091979A 1979-02-24 1979-02-24 Electrolytic composite super-finishing method on the external surface of cylinder Pending JPS55112731A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2091979A JPS55112731A (en) 1979-02-24 1979-02-24 Electrolytic composite super-finishing method on the external surface of cylinder
US06/123,648 US4294673A (en) 1979-02-24 1980-02-22 Method of mirror-finishing a cylindrical workpiece
DE3006711A DE3006711C2 (en) 1979-02-24 1980-02-22 Method and apparatus for mirror finishing a cylindrical workpiece
CH148480A CH644540A5 (en) 1979-02-24 1980-02-25 METHOD AND DEVICE FOR HIGH POLISHING A CYLINDRICAL WORKPIECE.
US06/201,335 US4328083A (en) 1979-02-24 1980-10-27 Apparatus for mirror-finishing a cylindrical

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2091979A JPS55112731A (en) 1979-02-24 1979-02-24 Electrolytic composite super-finishing method on the external surface of cylinder

Publications (1)

Publication Number Publication Date
JPS55112731A true JPS55112731A (en) 1980-08-30

Family

ID=12040624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2091979A Pending JPS55112731A (en) 1979-02-24 1979-02-24 Electrolytic composite super-finishing method on the external surface of cylinder

Country Status (1)

Country Link
JP (1) JPS55112731A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822626A (en) * 1981-08-03 1983-02-10 Agency Of Ind Science & Technol Method of compound super finishing of electrolysis and grinding
CN112589657A (en) * 2021-01-12 2021-04-02 四川安珂华科技有限公司 Semiconductor wafer polishing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822626A (en) * 1981-08-03 1983-02-10 Agency Of Ind Science & Technol Method of compound super finishing of electrolysis and grinding
JPH0138612B2 (en) * 1981-08-03 1989-08-15 Kogyo Gijutsu Incho
CN112589657A (en) * 2021-01-12 2021-04-02 四川安珂华科技有限公司 Semiconductor wafer polishing device
CN112589657B (en) * 2021-01-12 2022-09-30 史巴克电子(苏州)有限公司 Semiconductor wafer polishing device

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