JPS5511083A - Spatter coating system and vacuum vale* transporter and spatter source arranging device for said system - Google Patents
Spatter coating system and vacuum vale* transporter and spatter source arranging device for said systemInfo
- Publication number
- JPS5511083A JPS5511083A JP4157079A JP4157079A JPS5511083A JP S5511083 A JPS5511083 A JP S5511083A JP 4157079 A JP4157079 A JP 4157079A JP 4157079 A JP4157079 A JP 4157079A JP S5511083 A JPS5511083 A JP S5511083A
- Authority
- JP
- Japan
- Prior art keywords
- spatter
- vale
- transporter
- vacuum
- arranging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
- Spray Control Apparatus (AREA)
- Coating By Spraying Or Casting (AREA)
- Nozzles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/894,287 US4313815A (en) | 1978-04-07 | 1978-04-07 | Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5511083A true JPS5511083A (en) | 1980-01-25 |
Family
ID=25402861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4157079A Pending JPS5511083A (en) | 1978-04-07 | 1979-04-07 | Spatter coating system and vacuum vale* transporter and spatter source arranging device for said system |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4313815A (enExample) |
| JP (1) | JPS5511083A (enExample) |
| DE (1) | DE2913724A1 (enExample) |
| FR (3) | FR2439242A1 (enExample) |
| IT (1) | IT1166732B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5794338A (en) * | 1980-12-04 | 1982-06-11 | Tdk Corp | Vapor deposition device |
| JP2019052371A (ja) * | 2017-09-14 | 2019-04-04 | エフ・ハー・エル・アンラーゲンバウ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 3dサブストレートを均一にコーティングするための方法及び装置 |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4756815A (en) * | 1979-12-21 | 1988-07-12 | Varian Associates, Inc. | Wafer coating system |
| EP0122092A3 (en) * | 1983-04-06 | 1985-07-10 | General Engineering Radcliffe Limited | Vacuum coating apparatus |
| US4534921A (en) * | 1984-03-06 | 1985-08-13 | Asm Fico Tooling, B.V. | Method and apparatus for mold cleaning by reverse sputtering |
| US4533449A (en) * | 1984-04-16 | 1985-08-06 | The Perkin-Elmer Corporation | Rapid surface figuring by selective deposition |
| US4661228A (en) * | 1984-05-17 | 1987-04-28 | Varian Associates, Inc. | Apparatus and method for manufacturing planarized aluminum films |
| US4606806A (en) * | 1984-05-17 | 1986-08-19 | Varian Associates, Inc. | Magnetron sputter device having planar and curved targets |
| US4761218A (en) * | 1984-05-17 | 1988-08-02 | Varian Associates, Inc. | Sputter coating source having plural target rings |
| US5021138A (en) * | 1985-01-17 | 1991-06-04 | Babu Suryadevara V | Side source center sink plasma reactor |
| US4663009A (en) * | 1985-02-08 | 1987-05-05 | Hewlett-Packard Company | System and method for depositing plural thin film layers on a substrate |
| JPS62502846A (ja) * | 1985-05-09 | 1987-11-12 | シ−ゲイト・テクノロジ− | 直列型ディスク・スパッタリング体系 |
| US4749465A (en) * | 1985-05-09 | 1988-06-07 | Seagate Technology | In-line disk sputtering system |
| US5082747A (en) * | 1985-11-12 | 1992-01-21 | Hedgcoth Virgle L | Magnetic recording disk and sputtering process and apparatus for producing same |
| US4894133A (en) * | 1985-11-12 | 1990-01-16 | Virgle L. Hedgcoth | Method and apparatus making magnetic recording disk |
| US4670126A (en) * | 1986-04-28 | 1987-06-02 | Varian Associates, Inc. | Sputter module for modular wafer processing system |
| DE3634710A1 (de) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
| US4795299A (en) * | 1987-04-15 | 1989-01-03 | Genus, Inc. | Dial deposition and processing apparatus |
| US5906688A (en) * | 1989-01-11 | 1999-05-25 | Ohmi; Tadahiro | Method of forming a passivation film |
| US5591267A (en) * | 1988-01-11 | 1997-01-07 | Ohmi; Tadahiro | Reduced pressure device |
| US5225057A (en) * | 1988-02-08 | 1993-07-06 | Optical Coating Laboratory, Inc. | Process for depositing optical films on both planar and non-planar substrates |
| US5798027A (en) * | 1988-02-08 | 1998-08-25 | Optical Coating Laboratory, Inc. | Process for depositing optical thin films on both planar and non-planar substrates |
| US5618388A (en) * | 1988-02-08 | 1997-04-08 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
| US4911810A (en) * | 1988-06-21 | 1990-03-27 | Brown University | Modular sputtering apparatus |
| US5683072A (en) * | 1988-11-01 | 1997-11-04 | Tadahiro Ohmi | Thin film forming equipment |
| US5789086A (en) * | 1990-03-05 | 1998-08-04 | Ohmi; Tadahiro | Stainless steel surface having passivation film |
| DE3912295C2 (de) * | 1989-04-14 | 1997-05-28 | Leybold Ag | Katodenzerstäubungsanlage |
| US6024843A (en) * | 1989-05-22 | 2000-02-15 | Novellus Systems, Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
| JPH03234979A (ja) * | 1990-02-09 | 1991-10-18 | Canon Inc | 仕切り弁 |
| DE4010495C2 (de) * | 1990-03-31 | 1997-07-31 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats mit Werkstoffen, beispielweise mit Metallen |
| JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
| USD453402S1 (en) | 1990-08-22 | 2002-02-05 | Hitachi, Ltd. | Vacuum processing equipment configuration |
| USRE39823E1 (en) * | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| US7089680B1 (en) | 1990-08-29 | 2006-08-15 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| USRE39756E1 (en) * | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| USD473354S1 (en) | 1990-08-29 | 2003-04-15 | Hitachi, Ltd. | Vacuum processing equipment configuration |
| EP0837491A3 (en) * | 1996-10-21 | 2000-11-15 | Nihon Shinku Gijutsu Kabushiki Kaisha | Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly |
| JP5026631B2 (ja) | 1999-06-24 | 2012-09-12 | 株式会社アルバック | スパッタリング装置 |
| US6605195B2 (en) | 2000-04-14 | 2003-08-12 | Seagate Technology Llc | Multi-layer deposition process using four ring sputter sources |
| CN102234784A (zh) * | 2010-04-29 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 镀膜系统 |
| CN102021576B (zh) * | 2010-09-30 | 2012-06-27 | 深圳市信诺泰创业投资企业(普通合伙) | 一种连续生产挠性覆铜板的方法 |
| CN103538894B (zh) * | 2013-10-25 | 2015-08-05 | 山东开泰工业科技有限公司 | 一种360抛丸器制造生产线 |
| WO2019212512A1 (en) * | 2018-04-30 | 2019-11-07 | Hewlett-Packard Development Company, L.P. | Multi directional physical vapor deposition (pvd) |
| US11713816B1 (en) | 2019-08-22 | 2023-08-01 | Colt Irrigation, LLC | Pressure loss mitigation and durable valve |
| DE102019134546B4 (de) * | 2019-12-16 | 2025-03-27 | VON ARDENNE Asset GmbH & Co. KG | Verfahren, Steuervorrichtung und Vakuumanordnung |
| CN120205788B (zh) * | 2025-05-28 | 2025-08-22 | 山西源盛铸锻实业有限公司 | 一种生产井盖用的落砂机 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51131461A (en) * | 1975-05-13 | 1976-11-15 | Ulvac Corp | A vacuum treatment chamber apparatus |
| JPS5322861B1 (enExample) * | 1972-07-12 | 1978-07-11 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2350322A (en) * | 1939-12-04 | 1944-06-06 | Berl Ernst | Process of making ammonium salts of aromatic compounds |
| GB747580A (en) * | 1952-12-05 | 1956-04-11 | Standard Telephones Cables Ltd | Method of making thin metal layers by cathodic sputtering |
| FR1574686A (enExample) * | 1968-01-11 | 1969-07-18 | ||
| FR1595037A (enExample) * | 1968-02-12 | 1970-06-08 | ||
| US3616402A (en) * | 1968-05-31 | 1971-10-26 | Western Electric Co | Sputtering method and apparatus |
| US3968018A (en) * | 1969-09-29 | 1976-07-06 | Warner-Lambert Company | Sputter coating method |
| US3641973A (en) * | 1970-11-25 | 1972-02-15 | Air Reduction | Vacuum coating apparatus |
| JPS4715202U (enExample) * | 1971-03-20 | 1972-10-23 | ||
| DE2114470B2 (de) * | 1971-03-25 | 1975-02-13 | Flachglas Ag Delog-Detag, 4650 Gelsenkirchen | Vorrichtung zum kontinuierlichen, einseitigen Beschichten von Platten, wie Glasscheiben, Keramik- oder Kunststoffplatten u. dgl. mittels Kathodenzerstäubung |
| AU485283B2 (en) * | 1971-05-18 | 1974-10-03 | Warner-Lambert Company | Method of making a razorblade |
| US3714925A (en) * | 1971-07-30 | 1973-02-06 | Gen Motors Corp | Vacuum processing machine |
| US3904506A (en) * | 1972-11-13 | 1975-09-09 | Shatterproof Glass Corp | Apparatus for continuous production of sputter-coated glass products |
| CH573985A5 (enExample) * | 1973-11-22 | 1976-03-31 | Balzers Patent Beteilig Ag | |
| US3973753A (en) * | 1974-03-18 | 1976-08-10 | Varian Associates | High vacuum gate valve |
| US4047624A (en) * | 1975-10-21 | 1977-09-13 | Airco, Inc. | Workpiece handling system for vacuum processing |
| DE2606847C2 (de) * | 1976-02-20 | 1982-11-25 | Geissinger, Franz | Absperrschieber |
| US4100055A (en) * | 1977-06-10 | 1978-07-11 | Varian Associates, Inc. | Target profile for sputtering apparatus |
-
1978
- 1978-04-07 US US05/894,287 patent/US4313815A/en not_active Expired - Lifetime
-
1979
- 1979-04-05 DE DE19792913724 patent/DE2913724A1/de not_active Ceased
- 1979-04-06 IT IT21645/79A patent/IT1166732B/it active
- 1979-04-07 JP JP4157079A patent/JPS5511083A/ja active Pending
- 1979-04-09 FR FR7908918A patent/FR2439242A1/fr active Granted
- 1979-12-28 FR FR7932015A patent/FR2439244B1/fr not_active Expired
- 1979-12-28 FR FR7932014A patent/FR2439243A1/fr active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5322861B1 (enExample) * | 1972-07-12 | 1978-07-11 | ||
| JPS51131461A (en) * | 1975-05-13 | 1976-11-15 | Ulvac Corp | A vacuum treatment chamber apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5794338A (en) * | 1980-12-04 | 1982-06-11 | Tdk Corp | Vapor deposition device |
| JP2019052371A (ja) * | 2017-09-14 | 2019-04-04 | エフ・ハー・エル・アンラーゲンバウ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 3dサブストレートを均一にコーティングするための方法及び装置 |
| US11913108B2 (en) | 2017-09-14 | 2024-02-27 | Fhr Anlagenbau Gmbh | Method and device for homogeneously coating 3D substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2439243B1 (enExample) | 1983-04-15 |
| US4313815A (en) | 1982-02-02 |
| FR2439242B1 (enExample) | 1984-01-06 |
| IT7921645A0 (it) | 1979-04-06 |
| FR2439243A1 (fr) | 1980-05-16 |
| FR2439242A1 (fr) | 1980-05-16 |
| IT1166732B (it) | 1987-05-06 |
| FR2439244A1 (enExample) | 1980-05-16 |
| FR2439244B1 (enExample) | 1983-01-28 |
| DE2913724A1 (de) | 1979-10-11 |
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