JPS55100896A - Flux for soldering - Google Patents
Flux for solderingInfo
- Publication number
- JPS55100896A JPS55100896A JP755279A JP755279A JPS55100896A JP S55100896 A JPS55100896 A JP S55100896A JP 755279 A JP755279 A JP 755279A JP 755279 A JP755279 A JP 755279A JP S55100896 A JPS55100896 A JP S55100896A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- soldering
- plates
- urea
- granules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
PURPOSE:To eliminate corrosion and permit safe handling by using urea in the form of powder or granules or as an aqueous solution to soldering flux for iron plates, copper plates, zinc plates, etc. CONSTITUTION:Urea is used alone in the form of powder or granules or as an aqueous solution of concentration 10% or more for flux for soldering of thin iron plates to themselves or thin copper plates to themselves. Since this flux is inexpensive and urea has no corrosiveness, there is no need for washing away the excess flux with water or warm water after soldering. Further the lack of any violet poison matter provides safety of handling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP755279A JPS55100896A (en) | 1979-01-24 | 1979-01-24 | Flux for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP755279A JPS55100896A (en) | 1979-01-24 | 1979-01-24 | Flux for soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55100896A true JPS55100896A (en) | 1980-08-01 |
Family
ID=11668949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP755279A Pending JPS55100896A (en) | 1979-01-24 | 1979-01-24 | Flux for soldering |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55100896A (en) |
-
1979
- 1979-01-24 JP JP755279A patent/JPS55100896A/en active Pending
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