JPS5489958A - Wire bonding apparatus - Google Patents
Wire bonding apparatusInfo
- Publication number
- JPS5489958A JPS5489958A JP15648477A JP15648477A JPS5489958A JP S5489958 A JPS5489958 A JP S5489958A JP 15648477 A JP15648477 A JP 15648477A JP 15648477 A JP15648477 A JP 15648477A JP S5489958 A JPS5489958 A JP S5489958A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- point
- wire
- bonding point
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/075—
-
- H10W72/07521—
-
- H10W72/5445—
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15648477A JPS5489958A (en) | 1977-12-27 | 1977-12-27 | Wire bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15648477A JPS5489958A (en) | 1977-12-27 | 1977-12-27 | Wire bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5489958A true JPS5489958A (en) | 1979-07-17 |
| JPS6113380B2 JPS6113380B2 (ref) | 1986-04-12 |
Family
ID=15628759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15648477A Granted JPS5489958A (en) | 1977-12-27 | 1977-12-27 | Wire bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5489958A (ref) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58143A (ja) * | 1981-06-25 | 1983-01-05 | Shinkawa Ltd | 超音波ワイヤボンデイング方法 |
| JP2008028236A (ja) * | 2006-07-24 | 2008-02-07 | Shinko Electric Ind Co Ltd | ボンディングツールおよびバンプ形成方法 |
| WO2013067270A1 (en) * | 2011-11-04 | 2013-05-10 | Invensas Corporation | Bonding wedge |
-
1977
- 1977-12-27 JP JP15648477A patent/JPS5489958A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58143A (ja) * | 1981-06-25 | 1983-01-05 | Shinkawa Ltd | 超音波ワイヤボンデイング方法 |
| JP2008028236A (ja) * | 2006-07-24 | 2008-02-07 | Shinko Electric Ind Co Ltd | ボンディングツールおよびバンプ形成方法 |
| WO2013067270A1 (en) * | 2011-11-04 | 2013-05-10 | Invensas Corporation | Bonding wedge |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6113380B2 (ref) | 1986-04-12 |
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