JPS5482974A - Bonder for semiconductor device - Google Patents

Bonder for semiconductor device

Info

Publication number
JPS5482974A
JPS5482974A JP14994877A JP14994877A JPS5482974A JP S5482974 A JPS5482974 A JP S5482974A JP 14994877 A JP14994877 A JP 14994877A JP 14994877 A JP14994877 A JP 14994877A JP S5482974 A JPS5482974 A JP S5482974A
Authority
JP
Japan
Prior art keywords
junction
capillary
pellet
heat
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14994877A
Other languages
Japanese (ja)
Inventor
Shoji Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14994877A priority Critical patent/JPS5482974A/en
Publication of JPS5482974A publication Critical patent/JPS5482974A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To realize the adjustment of the junction position with the finger tip freely, and thus to perform the minute processing with a high efficiency and good operating property.
CONSTITUTION: Heat sink 16a is kept at 280°C with element assembly 15 provided. The junction part is covered with the jetted (16d) N2 gas, and the tip of the gold thin wire is put on one end of terminal part 4 of the ambient unit through operation of knob 22. And junction head 5 is lowered down to be heat-bonded. The heat bonding is applied then to the pellet pad and then to the other end of part 4, thus completing the junction. At the same time, substrate 11 is drifted to the left side via knob 40, and the mirror surface jig is positioned on capillary 32 to absorb pellet 33. With the right shift of the substrate, element package 36 which is heated and held on the heat sink comes right under the capillary. Then the capillary lowers down to solder the pellet to the package. In this way, a high-efficiency junction work becomes possible through a simple operation.
COPYRIGHT: (C)1979,JPO&Japio
JP14994877A 1977-12-15 1977-12-15 Bonder for semiconductor device Pending JPS5482974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14994877A JPS5482974A (en) 1977-12-15 1977-12-15 Bonder for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14994877A JPS5482974A (en) 1977-12-15 1977-12-15 Bonder for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5482974A true JPS5482974A (en) 1979-07-02

Family

ID=15486072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14994877A Pending JPS5482974A (en) 1977-12-15 1977-12-15 Bonder for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5482974A (en)

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