JPS5475664U - - Google Patents
Info
- Publication number
- JPS5475664U JPS5475664U JP1978121236U JP12123678U JPS5475664U JP S5475664 U JPS5475664 U JP S5475664U JP 1978121236 U JP1978121236 U JP 1978121236U JP 12123678 U JP12123678 U JP 12123678U JP S5475664 U JPS5475664 U JP S5475664U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/831,211 US4151547A (en) | 1977-09-07 | 1977-09-07 | Arrangement for heat transfer between a heat source and a heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5475664U true JPS5475664U (ja) | 1979-05-29 |
Family
ID=25258545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1978121236U Pending JPS5475664U (ja) | 1977-09-07 | 1978-09-05 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4151547A (ja) |
JP (1) | JPS5475664U (ja) |
DE (2) | DE2838404A1 (ja) |
FR (1) | FR2402998A1 (ja) |
IT (1) | IT1098753B (ja) |
SE (1) | SE7809398L (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013084937A1 (ja) * | 2011-12-09 | 2013-06-13 | 本田技研工業株式会社 | バッテリの固定構造 |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466483A (en) * | 1978-04-14 | 1984-08-21 | Whitfield Fred J | Methods and means for conducting heat from electronic components and the like |
US4301493A (en) * | 1979-02-07 | 1981-11-17 | Square D Company | Insulator mounting for panelboard |
US4320349A (en) * | 1979-12-13 | 1982-03-16 | Zenith Radio Corporation | Thermal coupler for amplifier temperature compensation |
FR2479564A1 (fr) * | 1980-03-26 | 1981-10-02 | Thomson Csf | Boitier d'encapsulation pour module de puissance en circuit hybride |
GB2090710B (en) * | 1980-12-26 | 1984-10-03 | Matsushita Electric Ind Co Ltd | Thermistor heating device |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4471837A (en) * | 1981-12-28 | 1984-09-18 | Aavid Engineering, Inc. | Graphite heat-sink mountings |
DE3209243A1 (de) * | 1982-03-13 | 1983-09-15 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Positionierungseinrichtung fuer den magnetkopf eines scheibenfoermigen magnetspeichers |
US4517585A (en) * | 1982-08-13 | 1985-05-14 | Lucas Chloride Ev Systems Limited | Heat sink for semi-conductor devices having terminals projecting from a heat sink transfer face |
US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
US4685987A (en) * | 1983-09-02 | 1987-08-11 | The Bergquist Company | Method of preparing interfacings of heat sinks with electrical devices |
US4730666A (en) * | 1986-04-30 | 1988-03-15 | International Business Machines Corporation | Flexible finned heat exchanger |
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
US4915167A (en) * | 1988-08-05 | 1990-04-10 | Westinghouse Electric Corp. | Thermal coupling to enhance heat transfer |
US4974119A (en) * | 1988-09-14 | 1990-11-27 | The Charles Stark Draper Laboratories, Inc. | Conforming heat sink assembly |
EP0363687B1 (en) * | 1988-09-20 | 1996-01-10 | Nec Corporation | Cooling structure for electronic components |
US5265670A (en) * | 1990-04-27 | 1993-11-30 | International Business Machines Corporation | Convection transfer system |
US5291371A (en) * | 1990-04-27 | 1994-03-01 | International Business Machines Corporation | Thermal joint |
JPH07114250B2 (ja) * | 1990-04-27 | 1995-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 熱伝達システム |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5172755A (en) * | 1992-04-01 | 1992-12-22 | Digital Equipment Corporation | Arcuate profiled heatsink apparatus and method |
US5510174A (en) * | 1993-07-14 | 1996-04-23 | Chomerics, Inc. | Thermally conductive materials containing titanium diboride filler |
US6087916A (en) * | 1996-07-30 | 2000-07-11 | Soft Switching Technologies, Inc. | Cooling of coaxial winding transformers in high power applications |
US5904796A (en) * | 1996-12-05 | 1999-05-18 | Power Devices, Inc. | Adhesive thermal interface and method of making the same |
US6507116B1 (en) | 1997-04-24 | 2003-01-14 | International Business Machines Corporation | Electronic package and method of forming |
US7186003B2 (en) | 1997-08-26 | 2007-03-06 | Color Kinetics Incorporated | Light-emitting diode based products |
US7352339B2 (en) * | 1997-08-26 | 2008-04-01 | Philips Solid-State Lighting Solutions | Diffuse illumination systems and methods |
US6806659B1 (en) * | 1997-08-26 | 2004-10-19 | Color Kinetics, Incorporated | Multicolored LED lighting method and apparatus |
US7064498B2 (en) * | 1997-08-26 | 2006-06-20 | Color Kinetics Incorporated | Light-emitting diode based products |
JPH11121666A (ja) | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | マルチチップモジュールの冷却装置 |
US7132804B2 (en) * | 1997-12-17 | 2006-11-07 | Color Kinetics Incorporated | Data delivery track |
JP3936485B2 (ja) * | 1999-02-25 | 2007-06-27 | 富士通株式会社 | プリント配線基板ユニットおよび基板用矯正部品 |
US6496373B1 (en) | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
PT1422975E (pt) * | 2000-04-24 | 2010-07-09 | Philips Solid State Lighting | Produto base de leds |
JP4415503B2 (ja) * | 2000-05-12 | 2010-02-17 | 株式会社デンソー | 半導体装置 |
US6616999B1 (en) * | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
US6869642B2 (en) * | 2000-05-18 | 2005-03-22 | Raymond G. Freuler | Phase change thermal interface composition having induced bonding property |
US6652705B1 (en) | 2000-05-18 | 2003-11-25 | Power Devices, Inc. | Graphitic allotrope interface composition and method of fabricating the same |
US20030218057A1 (en) * | 2000-11-07 | 2003-11-27 | Craig Joseph | Electrical bus with associated porous metal heat sink and method of manufacturing same |
US6672378B2 (en) | 2001-06-07 | 2004-01-06 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
US6483707B1 (en) | 2001-06-07 | 2002-11-19 | Loctite Corporation | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
US7358929B2 (en) * | 2001-09-17 | 2008-04-15 | Philips Solid-State Lighting Solutions, Inc. | Tile lighting methods and systems |
US6552907B1 (en) * | 2001-10-11 | 2003-04-22 | Lsi Logic Corporation | BGA heat ball plate spreader, BGA to PCB plate interface |
US20040246682A1 (en) * | 2003-06-09 | 2004-12-09 | Sumitomo Metal (Smi) Eectronics Devices Inc. | Apparatus and package for high frequency usages and their manufacturing method |
US6828529B1 (en) * | 2003-06-18 | 2004-12-07 | Chia-Hsiung Wu | Integrated form of cooling fin in heating body |
US7200006B2 (en) * | 2004-06-03 | 2007-04-03 | International Business Machines Corporation | Compliant thermal interface for electronic equipment |
US7543956B2 (en) * | 2005-02-28 | 2009-06-09 | Philips Solid-State Lighting Solutions, Inc. | Configurations and methods for embedding electronics or light emitters in manufactured materials |
US7518066B2 (en) * | 2005-09-01 | 2009-04-14 | Gm Global Technology Operations, Inc. | Conformable interface device for improved electrical joint |
US7646608B2 (en) * | 2005-09-01 | 2010-01-12 | Gm Global Technology Operations, Inc. | Heat transfer plate |
US7593228B2 (en) * | 2005-10-26 | 2009-09-22 | Indium Corporation Of America | Technique for forming a thermally conductive interface with patterned metal foil |
US20080068803A1 (en) * | 2006-09-18 | 2008-03-20 | Shyh-Ming Chen | Heat dissipating device holder structure with a thin film thermal conducting medium coating |
US7694719B2 (en) * | 2007-01-04 | 2010-04-13 | International Business Machines Corporation | Patterned metal thermal interface |
US7995344B2 (en) * | 2007-01-09 | 2011-08-09 | Lockheed Martin Corporation | High performance large tolerance heat sink |
US20090109628A1 (en) * | 2007-10-30 | 2009-04-30 | International Business Machines Corporation | Chip Cooling System with Convex Portion |
US7907410B2 (en) * | 2007-11-08 | 2011-03-15 | International Business Machines Corporation | Universal patterned metal thermal interface |
US8279033B2 (en) * | 2008-01-25 | 2012-10-02 | Tech Design, L.L.C. | Transformer with isolated cells |
US7961469B2 (en) * | 2009-03-31 | 2011-06-14 | Apple Inc. | Method and apparatus for distributing a thermal interface material |
DE102011078460A1 (de) * | 2011-06-30 | 2013-01-03 | Robert Bosch Gmbh | Elektronische Schaltungsanordnung zur Entwärmung von Verlustwärme abgebenden Komponenten |
US9271427B2 (en) | 2012-11-28 | 2016-02-23 | Hamilton Sundstrand Corporation | Flexible thermal transfer strips |
IL229744A0 (en) * | 2013-12-01 | 2014-03-31 | Yosi Wolf | Heat transport device |
US9686853B2 (en) | 2014-06-09 | 2017-06-20 | International Business Machines Corporation | Thermal interface solution with reduced adhesion force |
CA3017370A1 (en) * | 2016-03-11 | 2017-09-14 | Finisar Corporation | Thermal interface |
EP3309913B1 (en) * | 2016-10-17 | 2024-09-25 | Universität Stuttgart | Radiation field amplifier system |
EP3309914A1 (en) | 2016-10-17 | 2018-04-18 | Universität Stuttgart | Radiation field amplifier system |
DE102019202156A1 (de) * | 2019-02-18 | 2020-08-20 | Audi Ag | Befestigungsanordnung, Toleranzausgleichsanordnung für eine Befestigungseinrichtung und Montageverfahren zum Befestigen eines Batteriemoduls an einer Kühlvorrichtung |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA659585A (en) * | 1963-03-19 | Bendix Aviation Corporation | Electrically insulated, heat conducting washer | |
US3391242A (en) * | 1966-12-27 | 1968-07-02 | Admiral Corp | Transistor insulator with self-contained silicone grease supply |
US3492535A (en) * | 1968-01-08 | 1970-01-27 | Ncr Co | Ceramic circuit card |
GB1297046A (ja) * | 1969-08-25 | 1972-11-22 | ||
US3928907A (en) * | 1971-11-18 | 1975-12-30 | John Chisholm | Method of making thermal attachment to porous metal surfaces |
US3780795A (en) * | 1972-06-19 | 1973-12-25 | Rca Corp | Multilayer heat sink |
US3805123A (en) * | 1972-12-12 | 1974-04-16 | Itt | Arrangement for adhesively joining heat-dissipating circuit components to heat sinks and method of making them |
US3801882A (en) * | 1973-01-11 | 1974-04-02 | Us Navy | Thermo-electric mounting method for rf silicon power transistors |
-
1977
- 1977-09-07 US US05/831,211 patent/US4151547A/en not_active Expired - Lifetime
-
1978
- 1978-08-30 IT IT27129/78A patent/IT1098753B/it active
- 1978-09-01 FR FR7825275A patent/FR2402998A1/fr active Pending
- 1978-09-02 DE DE19782838404 patent/DE2838404A1/de not_active Withdrawn
- 1978-09-02 DE DE7826159U patent/DE7826159U1/de not_active Expired
- 1978-09-05 JP JP1978121236U patent/JPS5475664U/ja active Pending
- 1978-09-06 SE SE7809398A patent/SE7809398L/xx unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013084937A1 (ja) * | 2011-12-09 | 2013-06-13 | 本田技研工業株式会社 | バッテリの固定構造 |
JPWO2013084937A1 (ja) * | 2011-12-09 | 2015-04-27 | 本田技研工業株式会社 | バッテリの固定構造 |
US9509023B2 (en) | 2011-12-09 | 2016-11-29 | Honda Motor Co., Ltd. | Structure for securing battery |
Also Published As
Publication number | Publication date |
---|---|
DE2838404A1 (de) | 1979-03-22 |
US4151547A (en) | 1979-04-24 |
SE7809398L (sv) | 1979-03-08 |
FR2402998A1 (fr) | 1979-04-06 |
DE7826159U1 (de) | 1979-02-22 |
IT7827129A0 (it) | 1978-08-30 |
IT1098753B (it) | 1985-09-18 |