SE7809398L - Anordning for vermeoverforing mellan en elektrisk kraftalstrande anordning som genererar verme och en for denna avsedd vermekella - Google Patents

Anordning for vermeoverforing mellan en elektrisk kraftalstrande anordning som genererar verme och en for denna avsedd vermekella

Info

Publication number
SE7809398L
SE7809398L SE7809398A SE7809398A SE7809398L SE 7809398 L SE7809398 L SE 7809398L SE 7809398 A SE7809398 A SE 7809398A SE 7809398 A SE7809398 A SE 7809398A SE 7809398 L SE7809398 L SE 7809398L
Authority
SE
Sweden
Prior art keywords
heat
electric power
power cooling
cooling device
shell intended
Prior art date
Application number
SE7809398A
Other languages
English (en)
Inventor
J M Rhoades
P J Montanino
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE7809398L publication Critical patent/SE7809398L/sv

Links

Classifications

    • H10W40/258—
    • H10W40/611—
    • H10W40/235—
    • H10W40/242—
SE7809398A 1977-09-07 1978-09-06 Anordning for vermeoverforing mellan en elektrisk kraftalstrande anordning som genererar verme och en for denna avsedd vermekella SE7809398L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/831,211 US4151547A (en) 1977-09-07 1977-09-07 Arrangement for heat transfer between a heat source and a heat sink

Publications (1)

Publication Number Publication Date
SE7809398L true SE7809398L (sv) 1979-03-08

Family

ID=25258545

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7809398A SE7809398L (sv) 1977-09-07 1978-09-06 Anordning for vermeoverforing mellan en elektrisk kraftalstrande anordning som genererar verme och en for denna avsedd vermekella

Country Status (6)

Country Link
US (1) US4151547A (sv)
JP (1) JPS5475664U (sv)
DE (2) DE2838404A1 (sv)
FR (1) FR2402998A1 (sv)
IT (1) IT1098753B (sv)
SE (1) SE7809398L (sv)

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JP4415503B2 (ja) * 2000-05-12 2010-02-17 株式会社デンソー 半導体装置
US6616999B1 (en) * 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6869642B2 (en) * 2000-05-18 2005-03-22 Raymond G. Freuler Phase change thermal interface composition having induced bonding property
US20030218057A1 (en) * 2000-11-07 2003-11-27 Craig Joseph Electrical bus with associated porous metal heat sink and method of manufacturing same
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US6672378B2 (en) * 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US7358929B2 (en) * 2001-09-17 2008-04-15 Philips Solid-State Lighting Solutions, Inc. Tile lighting methods and systems
US6552907B1 (en) * 2001-10-11 2003-04-22 Lsi Logic Corporation BGA heat ball plate spreader, BGA to PCB plate interface
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US6828529B1 (en) * 2003-06-18 2004-12-07 Chia-Hsiung Wu Integrated form of cooling fin in heating body
US7200006B2 (en) * 2004-06-03 2007-04-03 International Business Machines Corporation Compliant thermal interface for electronic equipment
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US7518066B2 (en) * 2005-09-01 2009-04-14 Gm Global Technology Operations, Inc. Conformable interface device for improved electrical joint
US7593228B2 (en) * 2005-10-26 2009-09-22 Indium Corporation Of America Technique for forming a thermally conductive interface with patterned metal foil
US20080068803A1 (en) * 2006-09-18 2008-03-20 Shyh-Ming Chen Heat dissipating device holder structure with a thin film thermal conducting medium coating
US7694719B2 (en) * 2007-01-04 2010-04-13 International Business Machines Corporation Patterned metal thermal interface
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
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DE102011078460A1 (de) 2011-06-30 2013-01-03 Robert Bosch Gmbh Elektronische Schaltungsanordnung zur Entwärmung von Verlustwärme abgebenden Komponenten
WO2013084937A1 (ja) * 2011-12-09 2013-06-13 本田技研工業株式会社 バッテリの固定構造
US9271427B2 (en) 2012-11-28 2016-02-23 Hamilton Sundstrand Corporation Flexible thermal transfer strips
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US9686853B2 (en) 2014-06-09 2017-06-20 International Business Machines Corporation Thermal interface solution with reduced adhesion force
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DE102019202156A1 (de) * 2019-02-18 2020-08-20 Audi Ag Befestigungsanordnung, Toleranzausgleichsanordnung für eine Befestigungseinrichtung und Montageverfahren zum Befestigen eines Batteriemoduls an einer Kühlvorrichtung

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US3805123A (en) * 1972-12-12 1974-04-16 Itt Arrangement for adhesively joining heat-dissipating circuit components to heat sinks and method of making them
US3801882A (en) * 1973-01-11 1974-04-02 Us Navy Thermo-electric mounting method for rf silicon power transistors

Also Published As

Publication number Publication date
US4151547A (en) 1979-04-24
IT1098753B (it) 1985-09-18
IT7827129A0 (it) 1978-08-30
DE2838404A1 (de) 1979-03-22
FR2402998A1 (fr) 1979-04-06
DE7826159U1 (de) 1979-02-22
JPS5475664U (sv) 1979-05-29

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