JPS5475065A - Preparation of film circuit substrate - Google Patents
Preparation of film circuit substrateInfo
- Publication number
- JPS5475065A JPS5475065A JP14155477A JP14155477A JPS5475065A JP S5475065 A JPS5475065 A JP S5475065A JP 14155477 A JP14155477 A JP 14155477A JP 14155477 A JP14155477 A JP 14155477A JP S5475065 A JPS5475065 A JP S5475065A
- Authority
- JP
- Japan
- Prior art keywords
- preparation
- circuit substrate
- film circuit
- film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title 1
Landscapes
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14155477A JPS5475065A (en) | 1977-11-28 | 1977-11-28 | Preparation of film circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14155477A JPS5475065A (en) | 1977-11-28 | 1977-11-28 | Preparation of film circuit substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5475065A true JPS5475065A (en) | 1979-06-15 |
JPS6314515B2 JPS6314515B2 (en) | 1988-03-31 |
Family
ID=15294658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14155477A Granted JPS5475065A (en) | 1977-11-28 | 1977-11-28 | Preparation of film circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5475065A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196547A (en) * | 1992-09-11 | 1994-07-15 | Matsushita Electric Ind Co Ltd | Metal film deposition device and metal film deposition method |
EP0691679A3 (en) * | 1994-06-07 | 1996-05-01 | Texas Instruments Inc | Process for manufacturing an integrated circuit package assembly |
US20140054065A1 (en) * | 2012-08-21 | 2014-02-27 | Abner D. Joseph | Electrical circuit trace manufacturing for electro-chemical sensors |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5262658A (en) * | 1975-11-20 | 1977-05-24 | Asahi Chemical Ind | Printed circuit board blank and method of producing printed circuit board using same |
-
1977
- 1977-11-28 JP JP14155477A patent/JPS5475065A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5262658A (en) * | 1975-11-20 | 1977-05-24 | Asahi Chemical Ind | Printed circuit board blank and method of producing printed circuit board using same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196547A (en) * | 1992-09-11 | 1994-07-15 | Matsushita Electric Ind Co Ltd | Metal film deposition device and metal film deposition method |
EP0691679A3 (en) * | 1994-06-07 | 1996-05-01 | Texas Instruments Inc | Process for manufacturing an integrated circuit package assembly |
US20140054065A1 (en) * | 2012-08-21 | 2014-02-27 | Abner D. Joseph | Electrical circuit trace manufacturing for electro-chemical sensors |
Also Published As
Publication number | Publication date |
---|---|
JPS6314515B2 (en) | 1988-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5475064A (en) | Preparation of thick film resistance circuit | |
JPS53147968A (en) | Thick film circuit board | |
JPS5411177A (en) | Photograph film substrate | |
JPS544375A (en) | Circuit substrate | |
JPS5475065A (en) | Preparation of film circuit substrate | |
JPS5410971A (en) | Substrate for multiilayer circuit | |
JPS5466464A (en) | Simple preparation of circuit substrate | |
JPS5466463A (en) | Preparation of substrate of hybrid integrated circuit | |
JPS5463372A (en) | Preparation of printed circuit substrate | |
JPS531858A (en) | Method of forming thin film circuit | |
JPS5422573A (en) | Thick film circuit substrate | |
JPS53124760A (en) | Construction of circuit substrate | |
JPS5250562A (en) | Circuit substrate | |
JPS5475057A (en) | Preparation of circuit element | |
JPS543256A (en) | Resistance adjustment of thin film circuit | |
JPS5466470A (en) | Method of dividing printed circuit substrate | |
JPS5431572A (en) | Method of manufacturing thin film circuit | |
JPS5242260A (en) | Preparation of printed circuit | |
JPS525466A (en) | Thin film circuit | |
JPS5466458A (en) | Multilayer circuit substrate | |
JPS5472452A (en) | Preparation of electronic parts | |
JPS53147262A (en) | Thick film circuit board | |
JPS525468A (en) | Circuit substrate | |
JPS5427956A (en) | Method of making thick film integrated circuit | |
JPS5466462A (en) | Substrate of hybrid integrated circuit |