JPS5422573A - Thick film circuit substrate - Google Patents
Thick film circuit substrateInfo
- Publication number
- JPS5422573A JPS5422573A JP8666377A JP8666377A JPS5422573A JP S5422573 A JPS5422573 A JP S5422573A JP 8666377 A JP8666377 A JP 8666377A JP 8666377 A JP8666377 A JP 8666377A JP S5422573 A JPS5422573 A JP S5422573A
- Authority
- JP
- Japan
- Prior art keywords
- circuit substrate
- thick film
- film circuit
- thick
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8666377A JPS5422573A (en) | 1977-07-21 | 1977-07-21 | Thick film circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8666377A JPS5422573A (en) | 1977-07-21 | 1977-07-21 | Thick film circuit substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5422573A true JPS5422573A (en) | 1979-02-20 |
Family
ID=13893262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8666377A Pending JPS5422573A (en) | 1977-07-21 | 1977-07-21 | Thick film circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5422573A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05185274A (en) * | 1992-01-13 | 1993-07-27 | Komei Niki | Material for brazing and adhering method using this material |
JPH06151656A (en) * | 1992-11-13 | 1994-05-31 | Kyocera Corp | Semiconductor chip housing package |
-
1977
- 1977-07-21 JP JP8666377A patent/JPS5422573A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05185274A (en) * | 1992-01-13 | 1993-07-27 | Komei Niki | Material for brazing and adhering method using this material |
JPH06151656A (en) * | 1992-11-13 | 1994-05-31 | Kyocera Corp | Semiconductor chip housing package |
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