JPS52115366A - Thick film circuit substrate - Google Patents

Thick film circuit substrate

Info

Publication number
JPS52115366A
JPS52115366A JP3142276A JP3142276A JPS52115366A JP S52115366 A JPS52115366 A JP S52115366A JP 3142276 A JP3142276 A JP 3142276A JP 3142276 A JP3142276 A JP 3142276A JP S52115366 A JPS52115366 A JP S52115366A
Authority
JP
Japan
Prior art keywords
circuit substrate
thick film
film circuit
thick
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3142276A
Other languages
Japanese (ja)
Inventor
Tsuyoshi Fujita
Ichirou Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3142276A priority Critical patent/JPS52115366A/en
Publication of JPS52115366A publication Critical patent/JPS52115366A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP3142276A 1976-03-24 1976-03-24 Thick film circuit substrate Pending JPS52115366A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3142276A JPS52115366A (en) 1976-03-24 1976-03-24 Thick film circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3142276A JPS52115366A (en) 1976-03-24 1976-03-24 Thick film circuit substrate

Publications (1)

Publication Number Publication Date
JPS52115366A true JPS52115366A (en) 1977-09-27

Family

ID=12330803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3142276A Pending JPS52115366A (en) 1976-03-24 1976-03-24 Thick film circuit substrate

Country Status (1)

Country Link
JP (1) JPS52115366A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54163365A (en) * 1978-06-15 1979-12-25 Hitachi Chemical Co Ltd Method of producing ceramic circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54163365A (en) * 1978-06-15 1979-12-25 Hitachi Chemical Co Ltd Method of producing ceramic circuit board

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