JPS53147262A - Thick film circuit board - Google Patents

Thick film circuit board

Info

Publication number
JPS53147262A
JPS53147262A JP6212477A JP6212477A JPS53147262A JP S53147262 A JPS53147262 A JP S53147262A JP 6212477 A JP6212477 A JP 6212477A JP 6212477 A JP6212477 A JP 6212477A JP S53147262 A JPS53147262 A JP S53147262A
Authority
JP
Japan
Prior art keywords
circuit board
thick film
film circuit
thick
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6212477A
Other languages
Japanese (ja)
Inventor
Tomio Yokoyama
Takeshi Fujita
Ichirou Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6212477A priority Critical patent/JPS53147262A/en
Publication of JPS53147262A publication Critical patent/JPS53147262A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP6212477A 1977-05-30 1977-05-30 Thick film circuit board Pending JPS53147262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6212477A JPS53147262A (en) 1977-05-30 1977-05-30 Thick film circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6212477A JPS53147262A (en) 1977-05-30 1977-05-30 Thick film circuit board

Publications (1)

Publication Number Publication Date
JPS53147262A true JPS53147262A (en) 1978-12-21

Family

ID=13190995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6212477A Pending JPS53147262A (en) 1977-05-30 1977-05-30 Thick film circuit board

Country Status (1)

Country Link
JP (1) JPS53147262A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128147U (en) * 1981-02-03 1982-08-10
JP2007019912A (en) * 2005-07-08 2007-01-25 Hosiden Corp Mounting substrate and microphone mounted on the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128147U (en) * 1981-02-03 1982-08-10
JP2007019912A (en) * 2005-07-08 2007-01-25 Hosiden Corp Mounting substrate and microphone mounted on the same
US7687723B2 (en) 2005-07-08 2010-03-30 Hosiden Corporation Mounting substrate and microphone mounted thereon
KR101219264B1 (en) * 2005-07-08 2013-01-07 호시덴 가부시기가이샤 Printed circuit board and microphone mounted on the same

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