JPS5474574A - A grinder - Google Patents

A grinder

Info

Publication number
JPS5474574A
JPS5474574A JP14195077A JP14195077A JPS5474574A JP S5474574 A JPS5474574 A JP S5474574A JP 14195077 A JP14195077 A JP 14195077A JP 14195077 A JP14195077 A JP 14195077A JP S5474574 A JPS5474574 A JP S5474574A
Authority
JP
Japan
Prior art keywords
oscillation
tool
pressure
processed
ultrasonic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14195077A
Other languages
Japanese (ja)
Inventor
Kiyoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP14195077A priority Critical patent/JPS5474574A/en
Publication of JPS5474574A publication Critical patent/JPS5474574A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To improve processing performance and increase grinding speed twice as high by applying oscillation pressure by operating large-amplitude low-frequency oscillation. CONSTITUTION:Ultrasonic wave oscillation generated by ultrasonic wave oscillator 1 is applied to tool 4. Object being processed 5 is ground and processed by grinding grains provided at the end of tool 4. At this time, tool 4 is further given oscillation pressure by electromagnet oscillator 7, which oscillates at low frequency (10- 50Hz). In this way, by giving tool 4 oscillation-varying pressure, processing effects are remarkably enhanced.
JP14195077A 1977-11-25 1977-11-25 A grinder Pending JPS5474574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14195077A JPS5474574A (en) 1977-11-25 1977-11-25 A grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14195077A JPS5474574A (en) 1977-11-25 1977-11-25 A grinder

Publications (1)

Publication Number Publication Date
JPS5474574A true JPS5474574A (en) 1979-06-14

Family

ID=15303891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14195077A Pending JPS5474574A (en) 1977-11-25 1977-11-25 A grinder

Country Status (1)

Country Link
JP (1) JPS5474574A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61169552U (en) * 1985-04-11 1986-10-21
CN106313340A (en) * 2016-11-24 2017-01-11 太原理工大学 Engineering-ceramic complex-frequency ultrasonic processing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61169552U (en) * 1985-04-11 1986-10-21
CN106313340A (en) * 2016-11-24 2017-01-11 太原理工大学 Engineering-ceramic complex-frequency ultrasonic processing device

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