JPS5471369A - Method of packing resin of electronic parts - Google Patents

Method of packing resin of electronic parts

Info

Publication number
JPS5471369A
JPS5471369A JP13854877A JP13854877A JPS5471369A JP S5471369 A JPS5471369 A JP S5471369A JP 13854877 A JP13854877 A JP 13854877A JP 13854877 A JP13854877 A JP 13854877A JP S5471369 A JPS5471369 A JP S5471369A
Authority
JP
Japan
Prior art keywords
electronic parts
packing resin
packing
resin
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13854877A
Other languages
Japanese (ja)
Other versions
JPS606558B2 (en
Inventor
Akinobu Tamaoki
Hayato Takasago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13854877A priority Critical patent/JPS606558B2/en
Publication of JPS5471369A publication Critical patent/JPS5471369A/en
Publication of JPS606558B2 publication Critical patent/JPS606558B2/en
Expired legal-status Critical Current

Links

JP13854877A 1977-11-17 1977-11-17 Resin packaging method for electronic components Expired JPS606558B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13854877A JPS606558B2 (en) 1977-11-17 1977-11-17 Resin packaging method for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13854877A JPS606558B2 (en) 1977-11-17 1977-11-17 Resin packaging method for electronic components

Publications (2)

Publication Number Publication Date
JPS5471369A true JPS5471369A (en) 1979-06-07
JPS606558B2 JPS606558B2 (en) 1985-02-19

Family

ID=15224714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13854877A Expired JPS606558B2 (en) 1977-11-17 1977-11-17 Resin packaging method for electronic components

Country Status (1)

Country Link
JP (1) JPS606558B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128552A (en) * 1987-11-13 1989-05-22 Asahi Glass Co Ltd Semiconductor device
JP2010123914A (en) * 2008-10-20 2010-06-03 Denso Corp Electronic control device
JP2010141158A (en) * 2008-12-12 2010-06-24 Denso Corp Electronic device
JP2010199516A (en) * 2009-02-27 2010-09-09 Denso Corp Electronic device
JP2011142366A (en) * 2008-10-20 2011-07-21 Denso Corp Electronic control device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128552A (en) * 1987-11-13 1989-05-22 Asahi Glass Co Ltd Semiconductor device
JP2010123914A (en) * 2008-10-20 2010-06-03 Denso Corp Electronic control device
JP2011142366A (en) * 2008-10-20 2011-07-21 Denso Corp Electronic control device
US8358514B2 (en) 2008-10-20 2013-01-22 Denso Corporation Electronic control device
JP2010141158A (en) * 2008-12-12 2010-06-24 Denso Corp Electronic device
JP2010199516A (en) * 2009-02-27 2010-09-09 Denso Corp Electronic device

Also Published As

Publication number Publication date
JPS606558B2 (en) 1985-02-19

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