JPS52147766A - Method of molding electronic parts - Google Patents

Method of molding electronic parts

Info

Publication number
JPS52147766A
JPS52147766A JP6528976A JP6528976A JPS52147766A JP S52147766 A JPS52147766 A JP S52147766A JP 6528976 A JP6528976 A JP 6528976A JP 6528976 A JP6528976 A JP 6528976A JP S52147766 A JPS52147766 A JP S52147766A
Authority
JP
Japan
Prior art keywords
electronic parts
molding electronic
molding
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6528976A
Other languages
Japanese (ja)
Inventor
Kazuhiko Oono
Jiyunji Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP6528976A priority Critical patent/JPS52147766A/en
Publication of JPS52147766A publication Critical patent/JPS52147766A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6528976A 1976-06-04 1976-06-04 Method of molding electronic parts Pending JPS52147766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6528976A JPS52147766A (en) 1976-06-04 1976-06-04 Method of molding electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6528976A JPS52147766A (en) 1976-06-04 1976-06-04 Method of molding electronic parts

Publications (1)

Publication Number Publication Date
JPS52147766A true JPS52147766A (en) 1977-12-08

Family

ID=13282614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6528976A Pending JPS52147766A (en) 1976-06-04 1976-06-04 Method of molding electronic parts

Country Status (1)

Country Link
JP (1) JPS52147766A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004506549A (en) * 2000-08-18 2004-03-04 スキナー，リー，マーチン Molding method
JP2008163608A (en) * 2006-12-27 2008-07-17 Cleanup Corp Floor panel structure of prefabricated bath and method of producing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832363B1 (en) * 1969-02-19 1973-10-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832363B1 (en) * 1969-02-19 1973-10-05

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004506549A (en) * 2000-08-18 2004-03-04 スキナー，リー，マーチン Molding method
JP2008163608A (en) * 2006-12-27 2008-07-17 Cleanup Corp Floor panel structure of prefabricated bath and method of producing the same

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