JPS5361057A - Method of sealing electronic parts by use of resin - Google Patents

Method of sealing electronic parts by use of resin

Info

Publication number
JPS5361057A
JPS5361057A JP13539276A JP13539276A JPS5361057A JP S5361057 A JPS5361057 A JP S5361057A JP 13539276 A JP13539276 A JP 13539276A JP 13539276 A JP13539276 A JP 13539276A JP S5361057 A JPS5361057 A JP S5361057A
Authority
JP
Japan
Prior art keywords
resin
electronic parts
sealing electronic
sealing
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13539276A
Other languages
Japanese (ja)
Inventor
Youichi Matsuda
Tadashi Itou
Masayuki Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13539276A priority Critical patent/JPS5361057A/en
Publication of JPS5361057A publication Critical patent/JPS5361057A/en
Pending legal-status Critical Current

Links

Landscapes

  • Thermistors And Varistors (AREA)
  • Casings For Electric Apparatus (AREA)
JP13539276A 1976-11-12 1976-11-12 Method of sealing electronic parts by use of resin Pending JPS5361057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13539276A JPS5361057A (en) 1976-11-12 1976-11-12 Method of sealing electronic parts by use of resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13539276A JPS5361057A (en) 1976-11-12 1976-11-12 Method of sealing electronic parts by use of resin

Publications (1)

Publication Number Publication Date
JPS5361057A true JPS5361057A (en) 1978-06-01

Family

ID=15150628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13539276A Pending JPS5361057A (en) 1976-11-12 1976-11-12 Method of sealing electronic parts by use of resin

Country Status (1)

Country Link
JP (1) JPS5361057A (en)

Similar Documents

Publication Publication Date Title
JPS538655A (en) Method of removing nonnset resin
JPS5366565A (en) Method of sealing electronic parts
JPS5322363A (en) Method of sealing electronic parts
JPS5285291A (en) Method of making liquid resin
JPS5326868A (en) Method of heat sealing of waterrsoluble resin
JPS5340899A (en) Method of stabilizing piezooelectric resin element
JPS52149348A (en) Method of sealing electronic parts
JPS52136293A (en) Method of making curable ureaaformaldehyde resin solution
JPS5471369A (en) Method of packing resin of electronic parts
JPS52146475A (en) Method of formation of resin by injection
JPS5278060A (en) Method of sealing electronic parts with resin
JPS52155357A (en) Method of making electronic parts
JPS5361057A (en) Method of sealing electronic parts by use of resin
JPS53100461A (en) Method of packing electronic parts
JPS52124160A (en) Method of manufacturing electronic parts
JPS5316066A (en) Resin compound and method of using it
JPS5376355A (en) Method of making electronic parts
JPS528466A (en) Resinous sealing of electronic parts
JPS52147766A (en) Method of molding electronic parts
JPS5361056A (en) Method of sealing electronic parts
JPS51121177A (en) Method of packing electronic parts
JPS53100459A (en) Method of sealing electronic parts by use of resin
JPS52141871A (en) Method of formation of resin by injection
JPS5485255A (en) Method of forming resin film
JPS53859A (en) Method of sealing electronic parts