JPS5469048A - Elastic surface wave element - Google Patents

Elastic surface wave element

Info

Publication number
JPS5469048A
JPS5469048A JP13641877A JP13641877A JPS5469048A JP S5469048 A JPS5469048 A JP S5469048A JP 13641877 A JP13641877 A JP 13641877A JP 13641877 A JP13641877 A JP 13641877A JP S5469048 A JPS5469048 A JP S5469048A
Authority
JP
Japan
Prior art keywords
substrate
case
adhesive
inter
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13641877A
Other languages
Japanese (ja)
Inventor
Kozo Machida
Masanobu Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP13641877A priority Critical patent/JPS5469048A/en
Publication of JPS5469048A publication Critical patent/JPS5469048A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To secure more perfect conductive performance on the back of the substrate by forming the metal film on the back of the substrate on the surface of which the inter-digital electrode is formed, and thus to increase the shielding effect as well as to enhance the side lobe of the frequency property. CONSTITUTION:Metal film (f) such as Al, Cu or the like is formed through the vacuum evaporation, spattering or plating means on the back of substrate (a), i.e., the adhesion side of the substrate to package case (b), and then attached to case (b) via conductive adhesive (e). This method features more perfect shielding effect in comparison with the conventional method in that the attachment is carried out only through adhesive (e). Then PZT of 0.5mm thick is used for substrate (a), and five pieces of 0.2mm grooves are provided (b) on the back of the inter-digital electrode. After this, the Cu film of 5000Angstrom is formed through the vacuum evaporation on the surfaces of the grooves and then adhered to case (b) via adhesive (b). Thus, the side lobe of frequency property 50 can be improved about 10dB in comparion with the conventionl one.
JP13641877A 1977-11-14 1977-11-14 Elastic surface wave element Pending JPS5469048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13641877A JPS5469048A (en) 1977-11-14 1977-11-14 Elastic surface wave element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13641877A JPS5469048A (en) 1977-11-14 1977-11-14 Elastic surface wave element

Publications (1)

Publication Number Publication Date
JPS5469048A true JPS5469048A (en) 1979-06-02

Family

ID=15174683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13641877A Pending JPS5469048A (en) 1977-11-14 1977-11-14 Elastic surface wave element

Country Status (1)

Country Link
JP (1) JPS5469048A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0088204A2 (en) * 1982-01-11 1983-09-14 Hitachi, Ltd. Surface acoustic wave transmission device
EP0224866A2 (en) * 1985-12-05 1987-06-10 Siemens Aktiengesellschaft Surface acoustic wave circuit element
KR20010062342A (en) * 2000-12-12 2001-07-07 정성식 The shape maintenance device of a shoes toe
WO2011004665A1 (en) * 2009-07-07 2011-01-13 株式会社村田製作所 Elastic wave device and manufacturing method of elastic wave device
US11082027B2 (en) 2017-02-02 2021-08-03 Taiyo Yuden Co., Ltd. Acoustic wave device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5057360A (en) * 1973-09-18 1975-05-19
JPS5057558A (en) * 1973-09-19 1975-05-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5057360A (en) * 1973-09-18 1975-05-19
JPS5057558A (en) * 1973-09-19 1975-05-20

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0088204A2 (en) * 1982-01-11 1983-09-14 Hitachi, Ltd. Surface acoustic wave transmission device
EP0224866A2 (en) * 1985-12-05 1987-06-10 Siemens Aktiengesellschaft Surface acoustic wave circuit element
KR20010062342A (en) * 2000-12-12 2001-07-07 정성식 The shape maintenance device of a shoes toe
WO2011004665A1 (en) * 2009-07-07 2011-01-13 株式会社村田製作所 Elastic wave device and manufacturing method of elastic wave device
JPWO2011004665A1 (en) * 2009-07-07 2012-12-20 株式会社村田製作所 Acoustic wave device and method of manufacturing acoustic wave device
US8339015B2 (en) 2009-07-07 2012-12-25 Murata Manufacturing Co., Ltd. Elastic wave device and method for manufacturing the same
JP5637136B2 (en) * 2009-07-07 2014-12-10 株式会社村田製作所 Acoustic wave device and method of manufacturing acoustic wave device
US11082027B2 (en) 2017-02-02 2021-08-03 Taiyo Yuden Co., Ltd. Acoustic wave device

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