JPS5461040A - Plating device - Google Patents

Plating device

Info

Publication number
JPS5461040A
JPS5461040A JP12795677A JP12795677A JPS5461040A JP S5461040 A JPS5461040 A JP S5461040A JP 12795677 A JP12795677 A JP 12795677A JP 12795677 A JP12795677 A JP 12795677A JP S5461040 A JPS5461040 A JP S5461040A
Authority
JP
Japan
Prior art keywords
cathode
anode
insol
plating
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12795677A
Other languages
Japanese (ja)
Other versions
JPS5952716B2 (en
Inventor
Sotaro Toki
Fuminobu Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP12795677A priority Critical patent/JPS5952716B2/en
Publication of JPS5461040A publication Critical patent/JPS5461040A/en
Publication of JPS5952716B2 publication Critical patent/JPS5952716B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To carry out thick plating on an electrically conductive pattern formed on a nonconductive substrate by bringing an insol. roll cathode and an anode consisting of an insol. roll covered with a nonconductor of porous permeable substance into contact with the face to be plated and rotating the cathode and anode.
CONSTITUTION: Electrically conductive pattern 2 is formed on nonconductive substrate 1 such as glass or plastics by electroless plating or printing with a conductive ink. Substrate 1 is then shallowly dispped in plating bath 9 in tank 8. Insol. metal roller cathode 11 made of noble metals, titanium, stainless steel, etc. and anode 12 covered with a nonconductor of porous permeable substance such as sponge or nylon cloth are connected with each other through support compasses 13. Cathode and anode rollers 11, 12 are moved back and forth while in contact with the face to be plated. Since cathode 11 electrically contacts with pattern 2, metal ions are supplied to pattern 2 through the porous substance of anode 12 to carry out plating.
COPYRIGHT: (C)1979,JPO&Japio
JP12795677A 1977-10-25 1977-10-25 plating device Expired JPS5952716B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12795677A JPS5952716B2 (en) 1977-10-25 1977-10-25 plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12795677A JPS5952716B2 (en) 1977-10-25 1977-10-25 plating device

Publications (2)

Publication Number Publication Date
JPS5461040A true JPS5461040A (en) 1979-05-17
JPS5952716B2 JPS5952716B2 (en) 1984-12-21

Family

ID=14972803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12795677A Expired JPS5952716B2 (en) 1977-10-25 1977-10-25 plating device

Country Status (1)

Country Link
JP (1) JPS5952716B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586999A (en) * 1981-07-07 1983-01-14 Satoosen:Kk Method and device for automatic continuous electroplating
JPS60159194A (en) * 1984-01-31 1985-08-20 Asahi Glass Co Ltd Method for plating electrically conductive printed wire on glass surface
JPH01240695A (en) * 1988-03-18 1989-09-26 Nkk Corp Anodic oxidation of titanium or titanium alloy material
WO1990009469A1 (en) * 1989-02-15 1990-08-23 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
US5114558A (en) * 1989-02-15 1992-05-19 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586999A (en) * 1981-07-07 1983-01-14 Satoosen:Kk Method and device for automatic continuous electroplating
JPS6247959B2 (en) * 1981-07-07 1987-10-12 Satosen Co Ltd
JPS60159194A (en) * 1984-01-31 1985-08-20 Asahi Glass Co Ltd Method for plating electrically conductive printed wire on glass surface
JPH01240695A (en) * 1988-03-18 1989-09-26 Nkk Corp Anodic oxidation of titanium or titanium alloy material
WO1990009469A1 (en) * 1989-02-15 1990-08-23 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
US5024735A (en) * 1989-02-15 1991-06-18 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
US5114558A (en) * 1989-02-15 1992-05-19 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
EP0458863B1 (en) * 1989-02-15 1999-08-11 KADIJA, Igor V. Method and apparatus for manufacturing interconnects with fine lines and spacing

Also Published As

Publication number Publication date
JPS5952716B2 (en) 1984-12-21

Similar Documents

Publication Publication Date Title
JPH10500736A (en) Method and apparatus for continuous uniform metallization or etching
JPS5461040A (en) Plating device
GR76777B (en)
JPS5268076A (en) Electrode for electrolysis
KR870011275A (en) Electrolyzer electrode, manufacturing method thereof and electrolyzer using same
KR920006544A (en) Anode for chromium plating, a manufacturing method thereof, and a chromium plating electrolysis method using a chromium plating electrolysis apparatus and an anode
JPS53122633A (en) Insoluble anode and electrolytic methdo in electroplating and the like
JPS54121237A (en) Electroplating
JPS57101693A (en) Vicinal electrolytic apparatus for strip
JPS56169798A (en) Plating apparatus
Trop Palladium Plating Procedure
Etkina et al. Electrochemical Mechanism of Chemical Copper Plating of Printed Circuit Boards
JPS5466888A (en) Production of electrode for oxygen sensor
ES2012606A6 (en) Method of eliminating a fern-like pattern during electroplating of metal strip.
Szczygiel et al. Anode Stability at High Current Densities
Abys Palladium Alloy Plating Process
JPS56166399A (en) Method for adjusting interelectrode distance in electroplating treatment
JPS57171690A (en) Plating method
Hedrich et al. Coating Thickness Distribution in Barrel Plating Taking Cyanide Silver Plating as an Example
Polukarov et al. Influence of Excess Concentration of Intermediate-Valence Ions on the Stability of a Plane Growth Front of Deposits From Sulphate Copper-Plating Solutions
Beyerle Method and Apparatus for Forming Printed Circuits
JPS53131235A (en) Manufacture of one-side plated strip steel sheet
Talov Two-Sided Electrochemical Marking Out of Thin Sheets
JPS57171687A (en) Plating device
JPS6461986A (en) Plating of printed board