JPS54574A - Sealing jig for semiconductor devices - Google Patents
Sealing jig for semiconductor devicesInfo
- Publication number
- JPS54574A JPS54574A JP6482977A JP6482977A JPS54574A JP S54574 A JPS54574 A JP S54574A JP 6482977 A JP6482977 A JP 6482977A JP 6482977 A JP6482977 A JP 6482977A JP S54574 A JPS54574 A JP S54574A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- sealing jig
- sealing
- jig
- automating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To produce a sealing jig for automating sealing process by press-forming recesses for containing cases of semiconductor devices with the same material as that of lead frames or assembling and bonding thin plates having blanked holes.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6482977A JPS6058590B2 (en) | 1977-06-03 | 1977-06-03 | Sealing jig for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6482977A JPS6058590B2 (en) | 1977-06-03 | 1977-06-03 | Sealing jig for semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54574A true JPS54574A (en) | 1979-01-05 |
JPS6058590B2 JPS6058590B2 (en) | 1985-12-20 |
Family
ID=13269516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6482977A Expired JPS6058590B2 (en) | 1977-06-03 | 1977-06-03 | Sealing jig for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6058590B2 (en) |
-
1977
- 1977-06-03 JP JP6482977A patent/JPS6058590B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6058590B2 (en) | 1985-12-20 |
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