JPS544398B2 - - Google Patents

Info

Publication number
JPS544398B2
JPS544398B2 JP6565874A JP6565874A JPS544398B2 JP S544398 B2 JPS544398 B2 JP S544398B2 JP 6565874 A JP6565874 A JP 6565874A JP 6565874 A JP6565874 A JP 6565874A JP S544398 B2 JPS544398 B2 JP S544398B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6565874A
Other languages
Japanese (ja)
Other versions
JPS5034094A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed filed Critical
Publication of JPS5034094A publication Critical patent/JPS5034094A/ja
Publication of JPS544398B2 publication Critical patent/JPS544398B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP6565874A 1973-06-11 1974-06-11 Expired JPS544398B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (enrdf_load_stackoverflow) 1974-02-19 1974-05-01

Publications (2)

Publication Number Publication Date
JPS5034094A JPS5034094A (enrdf_load_stackoverflow) 1975-04-02
JPS544398B2 true JPS544398B2 (enrdf_load_stackoverflow) 1979-03-06

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6565874A Expired JPS544398B2 (enrdf_load_stackoverflow) 1973-06-11 1974-06-11

Country Status (15)

Country Link
JP (1) JPS544398B2 (enrdf_load_stackoverflow)
BR (1) BR7404745A (enrdf_load_stackoverflow)
CA (1) CA1060136A (enrdf_load_stackoverflow)
CH (1) CH603725A5 (enrdf_load_stackoverflow)
DE (1) DE2427030C3 (enrdf_load_stackoverflow)
ES (1) ES427131A1 (enrdf_load_stackoverflow)
FR (1) FR2232614B1 (enrdf_load_stackoverflow)
GB (1) GB1448415A (enrdf_load_stackoverflow)
HK (1) HK45977A (enrdf_load_stackoverflow)
IE (1) IE39796B1 (enrdf_load_stackoverflow)
IL (1) IL44997A (enrdf_load_stackoverflow)
IT (1) IT1011946B (enrdf_load_stackoverflow)
MY (1) MY7700290A (enrdf_load_stackoverflow)
NL (1) NL162118C (enrdf_load_stackoverflow)
SE (1) SE413774B (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
EP0561048B1 (en) * 1992-03-16 1999-05-26 Raytheon Company Superior thermal transfer adhesive
JP2005054145A (ja) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc ガスバリア性(メタ)アクリレート樹脂硬化物および塗料、接着剤、フィルム
JP4336955B2 (ja) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 シクロヘキサントリカルボン酸モノエステルおよびその用途
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Dnpファインケミカル 接着組成物および硬化性接着シートの製造方法
JP2012256872A (ja) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc 誘電体への金属の接着促進
CN115926110A (zh) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 一种改性环氧树脂及其制备方法和应用

Also Published As

Publication number Publication date
GB1448415A (en) 1976-09-08
FR2232614B1 (enrdf_load_stackoverflow) 1977-09-30
NL162118B (nl) 1979-11-15
JPS5034094A (enrdf_load_stackoverflow) 1975-04-02
ES427131A1 (es) 1976-09-01
IL44997A0 (en) 1974-09-10
FR2232614A1 (enrdf_load_stackoverflow) 1975-01-03
IE39796L (en) 1974-12-11
CA1060136A (en) 1979-08-07
MY7700290A (en) 1977-12-31
IL44997A (en) 1977-05-31
SE413774B (sv) 1980-06-23
DE2427030B2 (de) 1979-12-20
NL7407729A (enrdf_load_stackoverflow) 1974-12-13
IE39796B1 (en) 1979-01-03
HK45977A (en) 1977-09-16
CH603725A5 (enrdf_load_stackoverflow) 1978-08-31
BR7404745A (pt) 1976-02-17
DE2427030C3 (de) 1980-08-28
SE7407533L (enrdf_load_stackoverflow) 1974-12-12
IT1011946B (it) 1977-02-10
DE2427030A1 (de) 1975-01-02
NL162118C (nl) 1980-04-15

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