FR2232614A1 - - Google Patents

Info

Publication number
FR2232614A1
FR2232614A1 FR7419964A FR7419964A FR2232614A1 FR 2232614 A1 FR2232614 A1 FR 2232614A1 FR 7419964 A FR7419964 A FR 7419964A FR 7419964 A FR7419964 A FR 7419964A FR 2232614 A1 FR2232614 A1 FR 2232614A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7419964A
Other languages
French (fr)
Other versions
FR2232614B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2232614A1 publication Critical patent/FR2232614A1/fr
Application granted granted Critical
Publication of FR2232614B1 publication Critical patent/FR2232614B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
FR7419964A 1973-06-11 1974-06-10 Expired FR2232614B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (enrdf_load_stackoverflow) 1974-02-19 1974-05-01

Publications (2)

Publication Number Publication Date
FR2232614A1 true FR2232614A1 (enrdf_load_stackoverflow) 1975-01-03
FR2232614B1 FR2232614B1 (enrdf_load_stackoverflow) 1977-09-30

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7419964A Expired FR2232614B1 (enrdf_load_stackoverflow) 1973-06-11 1974-06-10

Country Status (15)

Country Link
JP (1) JPS544398B2 (enrdf_load_stackoverflow)
BR (1) BR7404745A (enrdf_load_stackoverflow)
CA (1) CA1060136A (enrdf_load_stackoverflow)
CH (1) CH603725A5 (enrdf_load_stackoverflow)
DE (1) DE2427030C3 (enrdf_load_stackoverflow)
ES (1) ES427131A1 (enrdf_load_stackoverflow)
FR (1) FR2232614B1 (enrdf_load_stackoverflow)
GB (1) GB1448415A (enrdf_load_stackoverflow)
HK (1) HK45977A (enrdf_load_stackoverflow)
IE (1) IE39796B1 (enrdf_load_stackoverflow)
IL (1) IL44997A (enrdf_load_stackoverflow)
IT (1) IT1011946B (enrdf_load_stackoverflow)
MY (1) MY7700290A (enrdf_load_stackoverflow)
NL (1) NL162118C (enrdf_load_stackoverflow)
SE (1) SE413774B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0561048A3 (enrdf_load_stackoverflow) * 1992-03-16 1995-03-01 Hughes Aircraft Co

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
JP2005054145A (ja) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc ガスバリア性（メタ）アクリレート樹脂硬化物および塗料、接着剤、フィルム
JP4336955B2 (ja) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 シクロヘキサントリカルボン酸モノエステルおよびその用途
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル 接着組成物および硬化性接着シートの製造方法
JP2012256872A (ja) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc 誘電体への金属の接着促進
CN115926110A (zh) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 一种改性环氧树脂及其制备方法和应用

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0561048A3 (enrdf_load_stackoverflow) * 1992-03-16 1995-03-01 Hughes Aircraft Co

Also Published As

Publication number Publication date
SE413774B (sv) 1980-06-23
NL162118B (nl) 1979-11-15
SE7407533L (enrdf_load_stackoverflow) 1974-12-12
NL162118C (nl) 1980-04-15
IL44997A (en) 1977-05-31
JPS544398B2 (enrdf_load_stackoverflow) 1979-03-06
HK45977A (en) 1977-09-16
CA1060136A (en) 1979-08-07
JPS5034094A (enrdf_load_stackoverflow) 1975-04-02
CH603725A5 (enrdf_load_stackoverflow) 1978-08-31
ES427131A1 (es) 1976-09-01
IE39796L (en) 1974-12-11
IE39796B1 (en) 1979-01-03
NL7407729A (enrdf_load_stackoverflow) 1974-12-13
DE2427030C3 (de) 1980-08-28
DE2427030A1 (de) 1975-01-02
MY7700290A (en) 1977-12-31
IL44997A0 (en) 1974-09-10
IT1011946B (it) 1977-02-10
FR2232614B1 (enrdf_load_stackoverflow) 1977-09-30
BR7404745A (pt) 1976-02-17
DE2427030B2 (de) 1979-12-20
GB1448415A (en) 1976-09-08

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CD Change of name or company name