JPS5441102B2 - - Google Patents

Info

Publication number
JPS5441102B2
JPS5441102B2 JP2690775A JP2690775A JPS5441102B2 JP S5441102 B2 JPS5441102 B2 JP S5441102B2 JP 2690775 A JP2690775 A JP 2690775A JP 2690775 A JP2690775 A JP 2690775A JP S5441102 B2 JPS5441102 B2 JP S5441102B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2690775A
Other languages
Japanese (ja)
Other versions
JPS51101865A (US20020167097A1-20021114-C00005.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2690775A priority Critical patent/JPS5441102B2/ja
Priority to US05/662,440 priority patent/US4088828A/en
Publication of JPS51101865A publication Critical patent/JPS51101865A/ja
Publication of JPS5441102B2 publication Critical patent/JPS5441102B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2690775A 1975-03-04 1975-03-04 Expired JPS5441102B2 (US20020167097A1-20021114-C00005.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2690775A JPS5441102B2 (US20020167097A1-20021114-C00005.png) 1975-03-04 1975-03-04
US05/662,440 US4088828A (en) 1975-03-04 1976-03-01 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2690775A JPS5441102B2 (US20020167097A1-20021114-C00005.png) 1975-03-04 1975-03-04

Publications (2)

Publication Number Publication Date
JPS51101865A JPS51101865A (US20020167097A1-20021114-C00005.png) 1976-09-08
JPS5441102B2 true JPS5441102B2 (US20020167097A1-20021114-C00005.png) 1979-12-06

Family

ID=12206283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2690775A Expired JPS5441102B2 (US20020167097A1-20021114-C00005.png) 1975-03-04 1975-03-04

Country Status (2)

Country Link
US (1) US4088828A (US20020167097A1-20021114-C00005.png)
JP (1) JPS5441102B2 (US20020167097A1-20021114-C00005.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218081B2 (US20020167097A1-20021114-C00005.png) * 1980-04-16 1987-04-21 Sanyo Electric Co
JP4746990B2 (ja) * 2006-01-10 2011-08-10 株式会社日立国際電気 電子回路基板

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132466A (en) * 1975-05-13 1976-11-17 Tokyo Purinto Kougiyou Kk Method of manufacturing independent lands on printed wiring board
JPS5234365A (en) * 1975-09-11 1977-03-16 Sanyo Electric Co Method of insulating printed board
JPS5340458U (US20020167097A1-20021114-C00005.png) * 1976-09-13 1978-04-07
JPS5386567U (US20020167097A1-20021114-C00005.png) * 1976-12-20 1978-07-17
JPS5742020Y2 (US20020167097A1-20021114-C00005.png) * 1976-12-20 1982-09-16
US4178855A (en) * 1978-03-20 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Explosive actuated arming switch device
JPS5529527U (US20020167097A1-20021114-C00005.png) * 1978-08-18 1980-02-26
JPS5724775U (US20020167097A1-20021114-C00005.png) * 1980-07-17 1982-02-08
EP0044803A3 (de) * 1980-07-17 1984-08-15 Siemens Aktiengesellschaft Verfahren zum Herstellen einer mit elektrischen Bauelementen bestückten Leiterplatte
US4428043A (en) 1981-08-24 1984-01-24 Burroughs Corporation Data communications network
US4508990A (en) * 1982-09-17 1985-04-02 Sigmatron Associates Thin-film EL panel mounting unit
US4546283A (en) * 1984-05-04 1985-10-08 The United States Of America As Represented By The Secretary Of The Air Force Conductor structure for thick film electrical device
JP2575109B2 (ja) * 1985-11-08 1997-01-22 ソニー株式会社 プリント配線基板
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
JPS62184785U (US20020167097A1-20021114-C00005.png) * 1986-05-16 1987-11-24
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
JPH01161368U (US20020167097A1-20021114-C00005.png) * 1988-04-27 1989-11-09
EP0346522A3 (en) * 1988-06-16 1991-04-03 Nippon CMK Corp. Printed wiring board
AT398876B (de) * 1991-10-31 1995-02-27 Philips Nv Zwei- oder mehrlagige leiterplatte
US5852397A (en) 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
DE4243356A1 (de) * 1992-12-21 1994-06-23 Siemens Ag Bestückungsverfahren für eine Leiterplatte
WO1995031816A1 (en) 1994-05-16 1995-11-23 Raychem Corporation Electrical devices comprising a ptc resistive element
JPH1154237A (ja) * 1997-08-07 1999-02-26 Yazaki Corp 配線基板の放電構造
US6640420B1 (en) * 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6854176B2 (en) * 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
JP2001135906A (ja) * 1999-11-05 2001-05-18 Yazaki Corp 配線板の電気部品接続構造
JP2001264667A (ja) * 2000-03-15 2001-09-26 Sony Corp 光スキャニング装置
JP3624151B2 (ja) * 2000-10-24 2005-03-02 Ｔｄｋ株式会社 電気部品の接続構造
US6849805B2 (en) * 2000-12-28 2005-02-01 Canon Kabushiki Kaisha Printed wiring board and electronic apparatus
JP4554873B2 (ja) * 2002-04-22 2010-09-29 日本電気株式会社 配線板、電子機器および電子部品の実装方法並びに製造方法
JP5236707B2 (ja) * 2010-09-22 2013-07-17 日立オートモティブシステムズ株式会社 電子機器制御装置
DE102019116103B4 (de) * 2019-06-13 2021-04-22 Notion Systems GmbH Verfahren zum Beschriften einer Leiterplatte durch Erzeugen von Schattierungen in einer funktionalen Lackschicht

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818376U (US20020167097A1-20021114-C00005.png) * 1971-07-12 1973-03-01
JPS4851253A (US20020167097A1-20021114-C00005.png) * 1971-11-01 1973-07-18

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3339008A (en) * 1966-09-14 1967-08-29 Roger A Macarthur Circuit board having grooves to limit solder flow
JPS4861959A (US20020167097A1-20021114-C00005.png) * 1971-12-06 1973-08-30
US3969816A (en) * 1972-12-11 1976-07-20 Amp Incorporated Bonded wire interconnection system
GB1416671A (en) * 1973-02-14 1975-12-03 Siemens Ag Layer circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818376U (US20020167097A1-20021114-C00005.png) * 1971-07-12 1973-03-01
JPS4851253A (US20020167097A1-20021114-C00005.png) * 1971-11-01 1973-07-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218081B2 (US20020167097A1-20021114-C00005.png) * 1980-04-16 1987-04-21 Sanyo Electric Co
JP4746990B2 (ja) * 2006-01-10 2011-08-10 株式会社日立国際電気 電子回路基板

Also Published As

Publication number Publication date
JPS51101865A (US20020167097A1-20021114-C00005.png) 1976-09-08
US4088828A (en) 1978-05-09

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