JPS5433233A - Method of providing base plate with catalyst - Google Patents

Method of providing base plate with catalyst

Info

Publication number
JPS5433233A
JPS5433233A JP8410678A JP8410678A JPS5433233A JP S5433233 A JPS5433233 A JP S5433233A JP 8410678 A JP8410678 A JP 8410678A JP 8410678 A JP8410678 A JP 8410678A JP S5433233 A JPS5433233 A JP S5433233A
Authority
JP
Japan
Prior art keywords
catalyst
base plate
providing base
providing
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8410678A
Other languages
English (en)
Japanese (ja)
Inventor
Jiyosefu Fueroozu Kaaru
Beishiru Ruudo Hawaado
Daniiru Zatsukoni Seodoa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5433233A publication Critical patent/JPS5433233A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/34—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
    • B01J37/341—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of electric or magnetic fields, wave energy or particle radiation
    • B01J37/343—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of electric or magnetic fields, wave energy or particle radiation of ultrasonic wave energy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
JP8410678A 1977-08-19 1978-07-12 Method of providing base plate with catalyst Pending JPS5433233A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82589777A 1977-08-19 1977-08-19

Publications (1)

Publication Number Publication Date
JPS5433233A true JPS5433233A (en) 1979-03-10

Family

ID=25245181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8410678A Pending JPS5433233A (en) 1977-08-19 1978-07-12 Method of providing base plate with catalyst

Country Status (4)

Country Link
JP (1) JPS5433233A (it)
DE (1) DE2829919A1 (it)
FR (1) FR2400388A1 (it)
IT (1) IT1108993B (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007119900A (ja) * 2005-09-06 2007-05-17 Central Res Inst Of Electric Power Ind 金属−多孔質基材複合材料及びその製造方法
JP2013067856A (ja) * 2011-09-09 2013-04-18 Kansai Univ 触媒の吸着処理方法および吸着処理装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2309196A1 (de) * 1973-02-21 1974-09-05 Matsushita Electric Ind Co Ltd Verfahren zur herstellung gedruckter schaltungen
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007119900A (ja) * 2005-09-06 2007-05-17 Central Res Inst Of Electric Power Ind 金属−多孔質基材複合材料及びその製造方法
JP2013067856A (ja) * 2011-09-09 2013-04-18 Kansai Univ 触媒の吸着処理方法および吸着処理装置

Also Published As

Publication number Publication date
FR2400388A1 (fr) 1979-03-16
IT7826096A0 (it) 1978-07-26
DE2829919A1 (de) 1979-03-01
IT1108993B (it) 1985-12-16

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