IT1108993B - Processo di placcatura perfezionato - Google Patents
Processo di placcatura perfezionatoInfo
- Publication number
- IT1108993B IT1108993B IT26096/78A IT2609678A IT1108993B IT 1108993 B IT1108993 B IT 1108993B IT 26096/78 A IT26096/78 A IT 26096/78A IT 2609678 A IT2609678 A IT 2609678A IT 1108993 B IT1108993 B IT 1108993B
- Authority
- IT
- Italy
- Prior art keywords
- perfected
- plating process
- plating
- perfected plating
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
- B01J37/34—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
- B01J37/341—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of electric or magnetic fields, wave energy or particle radiation
- B01J37/343—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of electric or magnetic fields, wave energy or particle radiation of ultrasonic wave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82589777A | 1977-08-19 | 1977-08-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7826096A0 IT7826096A0 (it) | 1978-07-26 |
IT1108993B true IT1108993B (it) | 1985-12-16 |
Family
ID=25245181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT26096/78A IT1108993B (it) | 1977-08-19 | 1978-07-26 | Processo di placcatura perfezionato |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5433233A (it) |
DE (1) | DE2829919A1 (it) |
FR (1) | FR2400388A1 (it) |
IT (1) | IT1108993B (it) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5007990A (en) * | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
JP4903457B2 (ja) * | 2005-09-06 | 2012-03-28 | 財団法人電力中央研究所 | 金属−多孔質基材複合材料及びその製造方法 |
WO2013035480A1 (ja) * | 2011-09-09 | 2013-03-14 | 学校法人 関西大学 | 触媒の吸着処理方法および吸着処理装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2309196A1 (de) * | 1973-02-21 | 1974-09-05 | Matsushita Electric Ind Co Ltd | Verfahren zur herstellung gedruckter schaltungen |
US4008343A (en) * | 1975-08-15 | 1977-02-15 | Bell Telephone Laboratories, Incorporated | Process for electroless plating using colloid sensitization and acid rinse |
-
1978
- 1978-07-07 DE DE782829919A patent/DE2829919A1/de not_active Withdrawn
- 1978-07-12 JP JP8410678A patent/JPS5433233A/ja active Pending
- 1978-07-12 FR FR7821333A patent/FR2400388A1/fr active Pending
- 1978-07-26 IT IT26096/78A patent/IT1108993B/it active
Also Published As
Publication number | Publication date |
---|---|
IT7826096A0 (it) | 1978-07-26 |
DE2829919A1 (de) | 1979-03-01 |
FR2400388A1 (fr) | 1979-03-16 |
JPS5433233A (en) | 1979-03-10 |
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