Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP9800577ApriorityCriticalpatent/JPS5432065A/en
Publication of JPS5432065ApublicationCriticalpatent/JPS5432065A/en
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
Abstract
PURPOSE: To avoid the defective insulation by winding the connector to which plural units of semiconductor devices are connected via leads to the insulator and then moding the connector with the insulator.
COPYRIGHT: (C)1979,JPO&Japio
JP9800577A1977-08-151977-08-15Semiconductor device and its manufacture
PendingJPS5432065A
(en)