JPS5426909A - Sintered structure - Google Patents

Sintered structure

Info

Publication number
JPS5426909A
JPS5426909A JP9312477A JP9312477A JPS5426909A JP S5426909 A JPS5426909 A JP S5426909A JP 9312477 A JP9312477 A JP 9312477A JP 9312477 A JP9312477 A JP 9312477A JP S5426909 A JPS5426909 A JP S5426909A
Authority
JP
Japan
Prior art keywords
metal
electrically conductive
sintered product
jointing
sintered structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9312477A
Other languages
Japanese (ja)
Inventor
Eiichi Takayanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9312477A priority Critical patent/JPS5426909A/en
Publication of JPS5426909A publication Critical patent/JPS5426909A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Contacts (AREA)

Abstract

PURPOSE:To improve shaply the jointing strength and the reliability for jointing at the jointed part, by forming the evaporated layer of an electrically conductive metal at a part of the surface of the sintered product consisting of the substrate metal and electrically conductive metal and by soldering the sintered product to the pedestal metal at this surface.
JP9312477A 1977-08-03 1977-08-03 Sintered structure Pending JPS5426909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9312477A JPS5426909A (en) 1977-08-03 1977-08-03 Sintered structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9312477A JPS5426909A (en) 1977-08-03 1977-08-03 Sintered structure

Publications (1)

Publication Number Publication Date
JPS5426909A true JPS5426909A (en) 1979-02-28

Family

ID=14073764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9312477A Pending JPS5426909A (en) 1977-08-03 1977-08-03 Sintered structure

Country Status (1)

Country Link
JP (1) JPS5426909A (en)

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