JPS5423796B2 - - Google Patents

Info

Publication number
JPS5423796B2
JPS5423796B2 JP12767775A JP12767775A JPS5423796B2 JP S5423796 B2 JPS5423796 B2 JP S5423796B2 JP 12767775 A JP12767775 A JP 12767775A JP 12767775 A JP12767775 A JP 12767775A JP S5423796 B2 JPS5423796 B2 JP S5423796B2
Authority
JP
Japan
Prior art keywords
prepare
material suitable
predetermined volume
bonding works
works
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12767775A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5251867A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP50127677A priority Critical patent/JPS5251867A/ja
Publication of JPS5251867A publication Critical patent/JPS5251867A/ja
Publication of JPS5423796B2 publication Critical patent/JPS5423796B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP50127677A 1975-10-23 1975-10-23 Bonding wire for semiconductor device Granted JPS5251867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50127677A JPS5251867A (en) 1975-10-23 1975-10-23 Bonding wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50127677A JPS5251867A (en) 1975-10-23 1975-10-23 Bonding wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5251867A JPS5251867A (en) 1977-04-26
JPS5423796B2 true JPS5423796B2 (enExample) 1979-08-16

Family

ID=14965972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50127677A Granted JPS5251867A (en) 1975-10-23 1975-10-23 Bonding wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5251867A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115544A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5688329A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5676556A (en) * 1979-11-28 1981-06-24 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPS5688328A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS56115543A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5696844A (en) * 1979-12-29 1981-08-05 Tanaka Denshi Kogyo Kk Semiconductor element
IT1183375B (it) * 1984-02-24 1987-10-22 Hitachi Ltd Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori
JP2701419B2 (ja) * 1989-02-16 1998-01-21 三菱マテリアル株式会社 半導体素子用金合金細線及びその接合方法
DE19821395C2 (de) 1998-05-13 2000-06-29 Heraeus Gmbh W C Verwendung eines Feinstdrahtes aus einer nickelhaltigen Gold-Legierung
JP4130843B1 (ja) 2007-04-17 2008-08-06 田中電子工業株式会社 高信頼性金合金ボンディングワイヤ及び半導体装置
DE112011100491T5 (de) 2011-06-10 2013-06-13 Tanaka Denshi Kogyo K.K. Bonddraht aus Au-Legierung mit hoher Festigkeit und hoher Dehnungsrate

Also Published As

Publication number Publication date
JPS5251867A (en) 1977-04-26

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