JPS5419016B2 - - Google Patents
Info
- Publication number
- JPS5419016B2 JPS5419016B2 JP8054876A JP8054876A JPS5419016B2 JP S5419016 B2 JPS5419016 B2 JP S5419016B2 JP 8054876 A JP8054876 A JP 8054876A JP 8054876 A JP8054876 A JP 8054876A JP S5419016 B2 JPS5419016 B2 JP S5419016B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8054876A JPS536341A (en) | 1976-07-06 | 1976-07-06 | Method for vacuum pressure application |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8054876A JPS536341A (en) | 1976-07-06 | 1976-07-06 | Method for vacuum pressure application |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS536341A JPS536341A (en) | 1978-01-20 |
JPS5419016B2 true JPS5419016B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-07-12 |
Family
ID=13721387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8054876A Granted JPS536341A (en) | 1976-07-06 | 1976-07-06 | Method for vacuum pressure application |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS536341A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4382833A (en) * | 1981-08-25 | 1983-05-10 | Rca Corporation | Vacuum lamination fixture |
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
FR2659344A1 (fr) * | 1990-03-09 | 1991-09-13 | Thomson Csf | Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. |
WO2005117098A1 (ja) * | 2004-05-25 | 2005-12-08 | Tsubaki Seiko Inc. | テープ接着装置、テープ接着方法、および電子部品製造方法 |
FR2873499B1 (fr) * | 2004-07-23 | 2007-05-25 | Thales Sa | Procede d'encollage ou d'assemblage de plusieurs elements |
JPWO2009034819A1 (ja) * | 2007-09-11 | 2010-12-24 | コニカミノルタエムジー株式会社 | マイクロチップの製造方法、マイクロチップ、真空貼付装置 |
JP2009203284A (ja) * | 2008-02-26 | 2009-09-10 | Meisei Ind Co Ltd | 接着方法 |
WO2014057769A1 (ja) * | 2012-10-12 | 2014-04-17 | 新東工業株式会社 | 減圧治具及び減圧治具を用いた被加圧物の加圧方法 |
CN103722739A (zh) * | 2012-10-12 | 2014-04-16 | 爱元福科技股份有限公司 | 3d立体防爆玻璃之制造方法 |
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1976
- 1976-07-06 JP JP8054876A patent/JPS536341A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS536341A (en) | 1978-01-20 |