JPS536341A - Method for vacuum pressure application - Google Patents

Method for vacuum pressure application

Info

Publication number
JPS536341A
JPS536341A JP8054876A JP8054876A JPS536341A JP S536341 A JPS536341 A JP S536341A JP 8054876 A JP8054876 A JP 8054876A JP 8054876 A JP8054876 A JP 8054876A JP S536341 A JPS536341 A JP S536341A
Authority
JP
Japan
Prior art keywords
vacuum pressure
pressure application
film
adherend
involvement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8054876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5419016B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Seiki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP8054876A priority Critical patent/JPS536341A/ja
Publication of JPS536341A publication Critical patent/JPS536341A/ja
Publication of JPS5419016B2 publication Critical patent/JPS5419016B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP8054876A 1976-07-06 1976-07-06 Method for vacuum pressure application Granted JPS536341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8054876A JPS536341A (en) 1976-07-06 1976-07-06 Method for vacuum pressure application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8054876A JPS536341A (en) 1976-07-06 1976-07-06 Method for vacuum pressure application

Publications (2)

Publication Number Publication Date
JPS536341A true JPS536341A (en) 1978-01-20
JPS5419016B2 JPS5419016B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1979-07-12

Family

ID=13721387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8054876A Granted JPS536341A (en) 1976-07-06 1976-07-06 Method for vacuum pressure application

Country Status (1)

Country Link
JP (1) JPS536341A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382833A (en) * 1981-08-25 1983-05-10 Rca Corporation Vacuum lamination fixture
FR2659344A1 (fr) * 1990-03-09 1991-09-13 Thomson Csf Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre.
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
FR2873499A1 (fr) * 2004-07-23 2006-01-27 Thales Sa Procede d'encollage ou d'assemblage de plusieurs elements
WO2009034819A1 (ja) * 2007-09-11 2009-03-19 Konica Minolta Medical & Graphic, Inc. マイクロチップの製造方法、マイクロチップ、真空貼付装置
JP2009203284A (ja) * 2008-02-26 2009-09-10 Meisei Ind Co Ltd 接着方法
US7594977B2 (en) * 2004-05-25 2009-09-29 Tsubaki Seiko, Inc Tape bonder, tape bonding method, and process for manufacturing electronic component
CN103722739A (zh) * 2012-10-12 2014-04-16 爱元福科技股份有限公司 3d立体防爆玻璃之制造方法
CN104520977A (zh) * 2012-10-12 2015-04-15 新东工业株式会社 减压夹具以及使用减压夹具的被加压物的加压方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382833A (en) * 1981-08-25 1983-05-10 Rca Corporation Vacuum lamination fixture
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
FR2659344A1 (fr) * 1990-03-09 1991-09-13 Thomson Csf Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre.
US7594977B2 (en) * 2004-05-25 2009-09-29 Tsubaki Seiko, Inc Tape bonder, tape bonding method, and process for manufacturing electronic component
FR2873499A1 (fr) * 2004-07-23 2006-01-27 Thales Sa Procede d'encollage ou d'assemblage de plusieurs elements
EP1622437A1 (fr) 2004-07-23 2006-02-01 Thales Procédé d'encollage ou d'assemblage de plusieurs éléments
WO2009034819A1 (ja) * 2007-09-11 2009-03-19 Konica Minolta Medical & Graphic, Inc. マイクロチップの製造方法、マイクロチップ、真空貼付装置
JP2009203284A (ja) * 2008-02-26 2009-09-10 Meisei Ind Co Ltd 接着方法
CN103722739A (zh) * 2012-10-12 2014-04-16 爱元福科技股份有限公司 3d立体防爆玻璃之制造方法
CN104520977A (zh) * 2012-10-12 2015-04-15 新东工业株式会社 减压夹具以及使用减压夹具的被加压物的加压方法

Also Published As

Publication number Publication date
JPS5419016B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1979-07-12

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