JPS5417667A - Selecting method for semiconductor device - Google Patents

Selecting method for semiconductor device

Info

Publication number
JPS5417667A
JPS5417667A JP8224577A JP8224577A JPS5417667A JP S5417667 A JPS5417667 A JP S5417667A JP 8224577 A JP8224577 A JP 8224577A JP 8224577 A JP8224577 A JP 8224577A JP S5417667 A JPS5417667 A JP S5417667A
Authority
JP
Japan
Prior art keywords
semiconductor device
selecting method
goods
inferior goods
inspecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8224577A
Other languages
Japanese (ja)
Other versions
JPS6042615B2 (en
Inventor
Tomoyuki Tsuda
Masashi Mukogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP52082245A priority Critical patent/JPS6042615B2/en
Publication of JPS5417667A publication Critical patent/JPS5417667A/en
Publication of JPS6042615B2 publication Critical patent/JPS6042615B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent inferior goods from mixing in superior goods, by inspecting outward appearances of fabricated semiconductor device links and by giving detected inferior goods defective and electrical characteristics through the irradiation of a laser beam.
COPYRIGHT: (C)1979,JPO&Japio
JP52082245A 1977-07-08 1977-07-08 How to sort semiconductor devices Expired JPS6042615B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52082245A JPS6042615B2 (en) 1977-07-08 1977-07-08 How to sort semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52082245A JPS6042615B2 (en) 1977-07-08 1977-07-08 How to sort semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5417667A true JPS5417667A (en) 1979-02-09
JPS6042615B2 JPS6042615B2 (en) 1985-09-24

Family

ID=13769030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52082245A Expired JPS6042615B2 (en) 1977-07-08 1977-07-08 How to sort semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6042615B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340575Y2 (en) * 1985-02-26 1991-08-27

Also Published As

Publication number Publication date
JPS6042615B2 (en) 1985-09-24

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