JPS5417667A - Selecting method for semiconductor device - Google Patents
Selecting method for semiconductor deviceInfo
- Publication number
- JPS5417667A JPS5417667A JP8224577A JP8224577A JPS5417667A JP S5417667 A JPS5417667 A JP S5417667A JP 8224577 A JP8224577 A JP 8224577A JP 8224577 A JP8224577 A JP 8224577A JP S5417667 A JPS5417667 A JP S5417667A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- selecting method
- goods
- inferior goods
- inspecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE: To prevent inferior goods from mixing in superior goods, by inspecting outward appearances of fabricated semiconductor device links and by giving detected inferior goods defective and electrical characteristics through the irradiation of a laser beam.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52082245A JPS6042615B2 (en) | 1977-07-08 | 1977-07-08 | How to sort semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52082245A JPS6042615B2 (en) | 1977-07-08 | 1977-07-08 | How to sort semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5417667A true JPS5417667A (en) | 1979-02-09 |
JPS6042615B2 JPS6042615B2 (en) | 1985-09-24 |
Family
ID=13769030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52082245A Expired JPS6042615B2 (en) | 1977-07-08 | 1977-07-08 | How to sort semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6042615B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0340575Y2 (en) * | 1985-02-26 | 1991-08-27 |
-
1977
- 1977-07-08 JP JP52082245A patent/JPS6042615B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6042615B2 (en) | 1985-09-24 |
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