JPS54159326A - High tensile, electrically conductive copper alloy - Google Patents

High tensile, electrically conductive copper alloy

Info

Publication number
JPS54159326A
JPS54159326A JP6851578A JP6851578A JPS54159326A JP S54159326 A JPS54159326 A JP S54159326A JP 6851578 A JP6851578 A JP 6851578A JP 6851578 A JP6851578 A JP 6851578A JP S54159326 A JPS54159326 A JP S54159326A
Authority
JP
Japan
Prior art keywords
electrically conductive
alloy
copper alloy
high tensile
conductive copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6851578A
Other languages
Japanese (ja)
Other versions
JPS604893B2 (en
Inventor
Kenichi Komata
Tetsuya Umemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP6851578A priority Critical patent/JPS604893B2/en
Publication of JPS54159326A publication Critical patent/JPS54159326A/en
Publication of JPS604893B2 publication Critical patent/JPS604893B2/en
Expired legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To enhance the strength, electric conductivity and stress corrosion cracking sensibility resistance of a Cu alloy by using a specified amt. of Zn and Si as the alloying elements or by further using a specified amt. of Sb.
CONSTITUTION: The title Cu alloy useful as an electrically conductive material for the switching and wiring devices, etc. of an electrical appliance is obtd. by adding Zn; 5W20% and Si; 0.05W0.5% to Cu or by further adding Sb; 0.01W0.5%. This alloy has higher strength than that of brass, enhanced electrical conductivity, and much higher stress corrosion cracking sensibility resistance, so it is expected to be used as a substitute for brass.
COPYRIGHT: (C)1979,JPO&Japio
JP6851578A 1978-06-07 1978-06-07 Copper alloy for high strength conductivity Expired JPS604893B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6851578A JPS604893B2 (en) 1978-06-07 1978-06-07 Copper alloy for high strength conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6851578A JPS604893B2 (en) 1978-06-07 1978-06-07 Copper alloy for high strength conductivity

Publications (2)

Publication Number Publication Date
JPS54159326A true JPS54159326A (en) 1979-12-17
JPS604893B2 JPS604893B2 (en) 1985-02-07

Family

ID=13375921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6851578A Expired JPS604893B2 (en) 1978-06-07 1978-06-07 Copper alloy for high strength conductivity

Country Status (1)

Country Link
JP (1) JPS604893B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110004322A (en) * 2018-01-05 2019-07-12 比亚迪股份有限公司 A kind of copper-based microcrystallizing alloy and preparation method thereof and a kind of electronic product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110004322A (en) * 2018-01-05 2019-07-12 比亚迪股份有限公司 A kind of copper-based microcrystallizing alloy and preparation method thereof and a kind of electronic product
CN110004322B (en) * 2018-01-05 2021-05-14 比亚迪股份有限公司 Copper-based microcrystalline alloy, preparation method thereof and electronic product

Also Published As

Publication number Publication date
JPS604893B2 (en) 1985-02-07

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