JPS5414162A - Die bonding device - Google Patents
Die bonding deviceInfo
- Publication number
- JPS5414162A JPS5414162A JP8025577A JP8025577A JPS5414162A JP S5414162 A JPS5414162 A JP S5414162A JP 8025577 A JP8025577 A JP 8025577A JP 8025577 A JP8025577 A JP 8025577A JP S5414162 A JPS5414162 A JP S5414162A
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- bonding device
- die
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8025577A JPS5414162A (en) | 1977-07-05 | 1977-07-05 | Die bonding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8025577A JPS5414162A (en) | 1977-07-05 | 1977-07-05 | Die bonding device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14304480A Division JPS5935177B2 (ja) | 1980-10-15 | 1980-10-15 | ダイボンデイング装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5414162A true JPS5414162A (en) | 1979-02-02 |
Family
ID=13713197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8025577A Pending JPS5414162A (en) | 1977-07-05 | 1977-07-05 | Die bonding device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5414162A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62188329A (ja) * | 1986-02-14 | 1987-08-17 | Toshiba Seiki Kk | ペレツト装着装置 |
JPS63100737A (ja) * | 1986-10-17 | 1988-05-02 | Tokyo Sokuhan Kk | ダイボンデイング方法 |
JPS6435743U (ja) * | 1987-08-28 | 1989-03-03 | ||
JPH02205040A (ja) * | 1989-02-02 | 1990-08-14 | Nec Kyushu Ltd | 半導体装置の製造装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828961A (ja) * | 1971-08-20 | 1973-04-17 |
-
1977
- 1977-07-05 JP JP8025577A patent/JPS5414162A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828961A (ja) * | 1971-08-20 | 1973-04-17 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62188329A (ja) * | 1986-02-14 | 1987-08-17 | Toshiba Seiki Kk | ペレツト装着装置 |
JPS63100737A (ja) * | 1986-10-17 | 1988-05-02 | Tokyo Sokuhan Kk | ダイボンデイング方法 |
JPS6435743U (ja) * | 1987-08-28 | 1989-03-03 | ||
JPH02205040A (ja) * | 1989-02-02 | 1990-08-14 | Nec Kyushu Ltd | 半導体装置の製造装置 |
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