JPS54112737A - Vacuum depositing method and apparatus - Google Patents

Vacuum depositing method and apparatus

Info

Publication number
JPS54112737A
JPS54112737A JP1984178A JP1984178A JPS54112737A JP S54112737 A JPS54112737 A JP S54112737A JP 1984178 A JP1984178 A JP 1984178A JP 1984178 A JP1984178 A JP 1984178A JP S54112737 A JPS54112737 A JP S54112737A
Authority
JP
Japan
Prior art keywords
cover
right above
evaporation source
deposits
deposited film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984178A
Other languages
Japanese (ja)
Inventor
Takao Nagasaki
Hirobumi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1984178A priority Critical patent/JPS54112737A/en
Publication of JPS54112737A publication Critical patent/JPS54112737A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To form a vaccum deposited film with no projection on each wafer, etc. by alternately shifting a cover from a position right above a granular evaporation source to a position right above a metallic evaporation source to bury granular deposits in a metal-deposited film on the back side of the cover and thus to prevent granules from dropping. CONSTITUTION:After evacuating evaporation chamber 8, cover 2 is opened to deposit mixed vapor of evaporation sources 11a, 11b on wafers 5 to about 1 mu. The cover right above the Al evaporation source is shifted to right above the Si evaporation source, and the cover is alternately shifted from the Si side to the Al side every time. Thus, Si-Al or Al-Si deposits are alternately attached to the back side of cover 12, and the powdered Si deposits are buried in the Al-deposited film and metalled to prevent Si powder from dropping. Accordingly, bumping of Si powder is avoided even after several tens times of deposition, and the appearance yield of wafers can be enhanced.
JP1984178A 1978-02-24 1978-02-24 Vacuum depositing method and apparatus Pending JPS54112737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984178A JPS54112737A (en) 1978-02-24 1978-02-24 Vacuum depositing method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984178A JPS54112737A (en) 1978-02-24 1978-02-24 Vacuum depositing method and apparatus

Publications (1)

Publication Number Publication Date
JPS54112737A true JPS54112737A (en) 1979-09-03

Family

ID=12010484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984178A Pending JPS54112737A (en) 1978-02-24 1978-02-24 Vacuum depositing method and apparatus

Country Status (1)

Country Link
JP (1) JPS54112737A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04341110A (en) * 1991-07-04 1992-11-27 Iseki & Co Ltd Seedling feeder for rice transplanter
JP2012172263A (en) * 2011-02-23 2012-09-10 Samsung Electronics Co Ltd Method for surface coating and device for the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04341110A (en) * 1991-07-04 1992-11-27 Iseki & Co Ltd Seedling feeder for rice transplanter
JP2012172263A (en) * 2011-02-23 2012-09-10 Samsung Electronics Co Ltd Method for surface coating and device for the same

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