JPS54108894A - Polyester resin composition for electrical insulating encapsulation - Google Patents

Polyester resin composition for electrical insulating encapsulation

Info

Publication number
JPS54108894A
JPS54108894A JP1623378A JP1623378A JPS54108894A JP S54108894 A JPS54108894 A JP S54108894A JP 1623378 A JP1623378 A JP 1623378A JP 1623378 A JP1623378 A JP 1623378A JP S54108894 A JPS54108894 A JP S54108894A
Authority
JP
Japan
Prior art keywords
mol
unsaturated
dibasic acid
polyester resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1623378A
Other languages
Japanese (ja)
Inventor
Tonobu Sato
Tsutomu Sarudate
Iwao Maekawa
Noboru Monma
Isao Uchigasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP1623378A priority Critical patent/JPS54108894A/en
Publication of JPS54108894A publication Critical patent/JPS54108894A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the title composition having excellent adhesivity to the encapsulation case, and high compatibility to enameled wire, by compounding an unsaturated alkyd obtained from an α,β-unsaturated dibasic acid and dicyclopentadiene, a polymerizable monomer, and a filler.
CONSTITUTION: A composition composed of (A) 100 parts by weight of an unsaturated polyester resin comprising (1) an unsaturated alkyd having an acid value of ≤ 30, and containing 3.5-70 mol%, pref. 40-50 mol% of an α,β-unsaturated dibasic acid (based on total acid components) and 30-80 mol% of dicyclopentadiene (based on the above dibasic acid) and (2) a monomer polymerizable with the component (1), and (B) 100-500 parts by weight of a filler containing ≤0.15 wt% of water. When the molar ratio of the cyclopentadiene to the α,β-unsaturated dibasic acid is less than 30 mol%, the adhesivity of the product becomes poor, and when it exceeds 80 mol%, the trouble of undercure arises.
COPYRIGHT: (C)1979,JPO&Japio
JP1623378A 1978-02-15 1978-02-15 Polyester resin composition for electrical insulating encapsulation Pending JPS54108894A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1623378A JPS54108894A (en) 1978-02-15 1978-02-15 Polyester resin composition for electrical insulating encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1623378A JPS54108894A (en) 1978-02-15 1978-02-15 Polyester resin composition for electrical insulating encapsulation

Publications (1)

Publication Number Publication Date
JPS54108894A true JPS54108894A (en) 1979-08-25

Family

ID=11910826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1623378A Pending JPS54108894A (en) 1978-02-15 1978-02-15 Polyester resin composition for electrical insulating encapsulation

Country Status (1)

Country Link
JP (1) JPS54108894A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022253A (en) * 1973-06-30 1975-03-10
JPS5024386A (en) * 1973-06-30 1975-03-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022253A (en) * 1973-06-30 1975-03-10
JPS5024386A (en) * 1973-06-30 1975-03-15

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