JPS54105475A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS54105475A
JPS54105475A JP1149578A JP1149578A JPS54105475A JP S54105475 A JPS54105475 A JP S54105475A JP 1149578 A JP1149578 A JP 1149578A JP 1149578 A JP1149578 A JP 1149578A JP S54105475 A JPS54105475 A JP S54105475A
Authority
JP
Japan
Prior art keywords
lead
spacer
elastic
approximate
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1149578A
Other languages
Japanese (ja)
Inventor
Mitsugi Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1149578A priority Critical patent/JPS54105475A/en
Publication of JPS54105475A publication Critical patent/JPS54105475A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To fulfill resin sealing without producing flashes at a lead, by providing an elastic spacer in a curvature surface between cavity holders. CONSTITUTION:Spacer 20 obtained by working an elastic metal plate in a curvature is inserted between lower mold holder 22b and lower mold cavity 23b. Since mold space 24 is pressure-welded by the elastic spacer, dispersion in lead plate thickness even if appearing is absorbed and airtight contact is made. The elastic spacer, for example, uses quenched special steel, the sag for absorbing dispersion in the thickness of the lead is between approximate 30 to 50mu, and the weight of the lead is set to approximate 2 to 5 tons for one frame. The spacer is provided ejector-pin through hole 31, and relief holes 32 and 32'. In this constitution, no flashes will adhere to the lead frame.
JP1149578A 1978-02-06 1978-02-06 Manufacture of semiconductor device Pending JPS54105475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1149578A JPS54105475A (en) 1978-02-06 1978-02-06 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1149578A JPS54105475A (en) 1978-02-06 1978-02-06 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS54105475A true JPS54105475A (en) 1979-08-18

Family

ID=11779606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1149578A Pending JPS54105475A (en) 1978-02-06 1978-02-06 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54105475A (en)

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