JPS5381567U - - Google Patents
Info
- Publication number
- JPS5381567U JPS5381567U JP1976165080U JP16508076U JPS5381567U JP S5381567 U JPS5381567 U JP S5381567U JP 1976165080 U JP1976165080 U JP 1976165080U JP 16508076 U JP16508076 U JP 16508076U JP S5381567 U JPS5381567 U JP S5381567U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976165080U JPS608426Y2 (ja) | 1976-12-08 | 1976-12-08 | 半導体ウエハ−の保持基板 |
| US05/858,636 US4247590A (en) | 1976-12-08 | 1977-12-08 | Ceramic plate for supporting a semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976165080U JPS608426Y2 (ja) | 1976-12-08 | 1976-12-08 | 半導体ウエハ−の保持基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5381567U true JPS5381567U (US06818201-20041116-C00086.png) | 1978-07-06 |
| JPS608426Y2 JPS608426Y2 (ja) | 1985-03-25 |
Family
ID=15805482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976165080U Expired JPS608426Y2 (ja) | 1976-12-08 | 1976-12-08 | 半導体ウエハ−の保持基板 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4247590A (US06818201-20041116-C00086.png) |
| JP (1) | JPS608426Y2 (US06818201-20041116-C00086.png) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6046581A (ja) * | 1983-08-24 | 1985-03-13 | シャープ株式会社 | フラットディスプレイパネル |
| DE3336606A1 (de) * | 1983-10-07 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur mikropackherstellung |
| US4585690A (en) * | 1984-11-05 | 1986-04-29 | Busse James G | Cellular glass reinforced composite material |
| US4687693A (en) * | 1985-06-13 | 1987-08-18 | Stauffer Chemical Company | Adhesively mountable die attach film |
| US4876221A (en) * | 1988-05-03 | 1989-10-24 | Matsushita Electric Industrial Co., Ltd. | Bonding method |
| US5193732A (en) * | 1991-10-04 | 1993-03-16 | International Business Machines Corporation | Apparatus and methods for making simultaneous electrical connections |
| US5288007A (en) * | 1991-10-04 | 1994-02-22 | International Business Machine Corporation | Apparatus and methods for making simultaneous electrical connections |
| US20030092246A1 (en) * | 2001-10-11 | 2003-05-15 | Wanat Stanley F. | Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer |
| JP2006135272A (ja) * | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | 基板のサポートプレート及びサポートプレートの剥離方法 |
| JP4668052B2 (ja) * | 2005-12-06 | 2011-04-13 | 東京応化工業株式会社 | 剥離装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2816348A (en) * | 1955-06-23 | 1957-12-17 | Westinghouse Electric Corp | Resilient elastomeric electrical insulating tape |
| US2912382A (en) * | 1957-09-05 | 1959-11-10 | Gen Electric | Electrical insulating structure and method of making the same |
| US3079282A (en) * | 1960-05-24 | 1963-02-26 | Martin N Halier | Printed circuit on a ceramic base and method of making same |
| US3419412A (en) * | 1965-08-19 | 1968-12-31 | Kewanee Oil Co | Process for coating with epoxy compositions |
| US3471312A (en) * | 1965-10-21 | 1969-10-07 | Morton Int Inc | Epoxy coated substrate and method of making same |
| US3803075A (en) * | 1969-08-01 | 1974-04-09 | Ciba Geigy Corp | Soluble polyimides from 2,6-diamino-s-triazines and dianhydrides |
| US3706409A (en) * | 1970-02-26 | 1972-12-19 | Gen Electric | Semiconductor lead attachment system including a semiconductor pellet orientation plate |
| US3689357A (en) * | 1970-12-10 | 1972-09-05 | Gen Motors Corp | Glass-polysilicon dielectric isolation |
| DE2310062A1 (de) * | 1973-02-28 | 1974-08-29 | Siemens Ag | Dickschichtschaltung auf keramiksubstrat mit durchkontaktierungen zwischen den leiterzuegen auf beiden seiten des substrates |
| DE2429434B2 (de) * | 1974-06-19 | 1979-10-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung von Widerständen und Kondensatoren in Dunnschichtschaltungen |
| US4021100A (en) * | 1974-09-03 | 1977-05-03 | American Cyanamid Company | Electrochromic device having an electrolyte contained in a solid porous insulating layer |
| US3958317A (en) * | 1974-09-25 | 1976-05-25 | Rockwell International Corporation | Copper surface treatment for epoxy bonding |
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1976
- 1976-12-08 JP JP1976165080U patent/JPS608426Y2/ja not_active Expired
-
1977
- 1977-12-08 US US05/858,636 patent/US4247590A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS608426Y2 (ja) | 1985-03-25 |
| US4247590A (en) | 1981-01-27 |
