JPS5374364A - Gang bonding tool - Google Patents

Gang bonding tool

Info

Publication number
JPS5374364A
JPS5374364A JP14972276A JP14972276A JPS5374364A JP S5374364 A JPS5374364 A JP S5374364A JP 14972276 A JP14972276 A JP 14972276A JP 14972276 A JP14972276 A JP 14972276A JP S5374364 A JPS5374364 A JP S5374364A
Authority
JP
Japan
Prior art keywords
bonding tool
gang bonding
tool
gang
enhance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14972276A
Other languages
Japanese (ja)
Inventor
Masuzo Ikumi
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14972276A priority Critical patent/JPS5374364A/en
Publication of JPS5374364A publication Critical patent/JPS5374364A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce the heat conduction quantity and thus to enhance the junction working efficiency by providing a gate part between the main body and the tip portion of the tool.
COPYRIGHT: (C)1978,JPO&Japio
JP14972276A 1976-12-15 1976-12-15 Gang bonding tool Pending JPS5374364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14972276A JPS5374364A (en) 1976-12-15 1976-12-15 Gang bonding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14972276A JPS5374364A (en) 1976-12-15 1976-12-15 Gang bonding tool

Publications (1)

Publication Number Publication Date
JPS5374364A true JPS5374364A (en) 1978-07-01

Family

ID=15481375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14972276A Pending JPS5374364A (en) 1976-12-15 1976-12-15 Gang bonding tool

Country Status (1)

Country Link
JP (1) JPS5374364A (en)

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