JPS537173A - Solder-sealed ceramic package - Google Patents
Solder-sealed ceramic packageInfo
- Publication number
- JPS537173A JPS537173A JP8085676A JP8085676A JPS537173A JP S537173 A JPS537173 A JP S537173A JP 8085676 A JP8085676 A JP 8085676A JP 8085676 A JP8085676 A JP 8085676A JP S537173 A JPS537173 A JP S537173A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ceramic package
- sealed ceramic
- package body
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8085676A JPS537173A (en) | 1976-07-09 | 1976-07-09 | Solder-sealed ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8085676A JPS537173A (en) | 1976-07-09 | 1976-07-09 | Solder-sealed ceramic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS537173A true JPS537173A (en) | 1978-01-23 |
| JPS5538057B2 JPS5538057B2 (enrdf_load_stackoverflow) | 1980-10-02 |
Family
ID=13729977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8085676A Granted JPS537173A (en) | 1976-07-09 | 1976-07-09 | Solder-sealed ceramic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS537173A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852858A (ja) * | 1981-09-24 | 1983-03-29 | Nec Corp | 半導体装置 |
| JP2007202095A (ja) * | 2005-12-28 | 2007-08-09 | Kyocera Kinseki Corp | 圧電デバイス |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61142916U (enrdf_load_stackoverflow) * | 1985-02-25 | 1986-09-03 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4831511A (enrdf_load_stackoverflow) * | 1971-08-26 | 1973-04-25 |
-
1976
- 1976-07-09 JP JP8085676A patent/JPS537173A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4831511A (enrdf_load_stackoverflow) * | 1971-08-26 | 1973-04-25 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852858A (ja) * | 1981-09-24 | 1983-03-29 | Nec Corp | 半導体装置 |
| JP2007202095A (ja) * | 2005-12-28 | 2007-08-09 | Kyocera Kinseki Corp | 圧電デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5538057B2 (enrdf_load_stackoverflow) | 1980-10-02 |
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