JPS5364471A - Method of producing silicon nitride barrier on semiconductor substrate - Google Patents

Method of producing silicon nitride barrier on semiconductor substrate

Info

Publication number
JPS5364471A
JPS5364471A JP13798777A JP13798777A JPS5364471A JP S5364471 A JPS5364471 A JP S5364471A JP 13798777 A JP13798777 A JP 13798777A JP 13798777 A JP13798777 A JP 13798777A JP S5364471 A JPS5364471 A JP S5364471A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
silicon nitride
producing silicon
nitride barrier
barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13798777A
Other languages
English (en)
Inventor
Gusutabu Henrii Roiku
Nooeru Fuabensu Pieeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HENRY LOIC GUSTAVE
Original Assignee
HENRY LOIC GUSTAVE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HENRY LOIC GUSTAVE filed Critical HENRY LOIC GUSTAVE
Publication of JPS5364471A publication Critical patent/JPS5364471A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/318—Inorganic layers composed of nitrides
    • H01L21/3185—Inorganic layers composed of nitrides of siliconnitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Formation Of Insulating Films (AREA)
  • Physical Vapour Deposition (AREA)
JP13798777A 1976-11-18 1977-11-18 Method of producing silicon nitride barrier on semiconductor substrate Pending JPS5364471A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7635294A FR2371777A1 (fr) 1976-11-18 1976-11-18 Procede de fabrication d'une barriere de diffusion en nitrure de silicium sur un substrat de semiconducteur, en particulier du type iii-v

Publications (1)

Publication Number Publication Date
JPS5364471A true JPS5364471A (en) 1978-06-08

Family

ID=9180215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13798777A Pending JPS5364471A (en) 1976-11-18 1977-11-18 Method of producing silicon nitride barrier on semiconductor substrate

Country Status (4)

Country Link
US (1) US4137141A (ja)
JP (1) JPS5364471A (ja)
FR (1) FR2371777A1 (ja)
NL (1) NL7712708A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62164869A (ja) * 1986-01-16 1987-07-21 Nissin Electric Co Ltd 高硬度被覆材料とその製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2640078B1 (fr) * 1988-10-20 1992-07-31 Alcatel Transmission Procede de depot de nitrure de silicium, dispositif de mise en oeuvre de ce procede, et application dudit procede a la fabrication de capacites hyperfrequences
US5047363A (en) * 1990-09-04 1991-09-10 Motorola, Inc. Method and apparatus for reducing heterostructure acoustic charge transport device saw drive power requirements
US5217567A (en) * 1992-02-27 1993-06-08 International Business Machines Corporation Selective etching process for boron nitride films
JP4128898B2 (ja) * 2003-04-18 2008-07-30 古河電気工業株式会社 半導体素子の製造方法
US20060045986A1 (en) * 2004-08-30 2006-03-02 Hochberg Arthur K Silicon nitride from aminosilane using PECVD
US7732071B2 (en) * 2006-11-10 2010-06-08 Hitachi Global Storage Technologies Netherlands B.V. Perpendicular magnetic recording system with patterned medium and manufacturing process for the medium
US7670696B2 (en) * 2007-05-01 2010-03-02 Hitachi Global Storage Technologies Netherlands B.V. Perpendicular magnetic recording medium with patterned magnetic islands and nonmagnetic trenches and manufacturing method for suppressing surface diffusion of trench material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL257102A (ja) * 1960-10-18 1900-01-01
US3600218A (en) * 1968-05-15 1971-08-17 Ibm Method for depositing insulating films of silicon nitride and aluminum nitride
US3591477A (en) * 1968-07-17 1971-07-06 Mallory & Co Inc P R Process for growth and removal of passivating films in semiconductors
US3849276A (en) * 1971-03-19 1974-11-19 Ibm Process for forming reactive layers whose thickness is independent of time
GB1391842A (en) * 1971-08-04 1975-04-23 Elektromat Veb Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vessel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62164869A (ja) * 1986-01-16 1987-07-21 Nissin Electric Co Ltd 高硬度被覆材料とその製造方法

Also Published As

Publication number Publication date
FR2371777A1 (fr) 1978-06-16
NL7712708A (nl) 1978-05-22
FR2371777B1 (ja) 1980-08-22
US4137141A (en) 1979-01-30

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