JPS5336997B2 - - Google Patents
Info
- Publication number
- JPS5336997B2 JPS5336997B2 JP11392873A JP11392873A JPS5336997B2 JP S5336997 B2 JPS5336997 B2 JP S5336997B2 JP 11392873 A JP11392873 A JP 11392873A JP 11392873 A JP11392873 A JP 11392873A JP S5336997 B2 JPS5336997 B2 JP S5336997B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
Landscapes
- Formation Of Insulating Films (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11392873A JPS5336997B2 (https=) | 1973-10-12 | 1973-10-12 | |
| US05/514,956 US3946427A (en) | 1973-10-12 | 1974-10-15 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11392873A JPS5336997B2 (https=) | 1973-10-12 | 1973-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5066171A JPS5066171A (https=) | 1975-06-04 |
| JPS5336997B2 true JPS5336997B2 (https=) | 1978-10-05 |
Family
ID=14624691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11392873A Expired JPS5336997B2 (https=) | 1973-10-12 | 1973-10-12 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3946427A (https=) |
| JP (1) | JPS5336997B2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4163072A (en) * | 1977-06-07 | 1979-07-31 | Bell Telephone Laboratories, Incorporated | Encapsulation of circuits |
| US4173683A (en) * | 1977-06-13 | 1979-11-06 | Rca Corporation | Chemically treating the overcoat of a semiconductor device |
| US4230754A (en) * | 1978-11-07 | 1980-10-28 | Sprague Electric Company | Bonding electronic component to molded package |
| EP0021818B1 (en) * | 1979-06-21 | 1983-10-05 | Fujitsu Limited | Improved electronic device having multilayer wiring structure |
| US4327369A (en) * | 1979-08-06 | 1982-04-27 | Hi-Tech Industries, Inc. | Encapsulating moisture-proof coating |
| JPS60220967A (ja) * | 1984-04-18 | 1985-11-05 | Fuji Xerox Co Ltd | 半導体装置 |
| US4731257A (en) * | 1984-12-20 | 1988-03-15 | Mitsubishi Denki Kabushiki Kaisha | Process for producing a temperature and moisture sensitive element |
| US4592928A (en) * | 1985-01-09 | 1986-06-03 | Dow Corning Corporation | Method and compositions for inhibiting leakage current in silicon diodes |
| JPS63213347A (ja) * | 1987-02-27 | 1988-09-06 | Mitsubishi Electric Corp | 半導体装置 |
| AT391859B (de) * | 1989-04-10 | 1990-12-10 | Avl Verbrennungskraft Messtech | Verfahren zur erniedrigung und stabilisierung der elektrischen leitfaehigkeit |
| KR940011569B1 (ko) * | 1990-10-24 | 1994-12-21 | 미쯔비시덴끼 가부시끼가이샤 | 저 반사막을 갖는 음극선관 |
| JPH04261049A (ja) * | 1991-01-31 | 1992-09-17 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| US5459352A (en) * | 1993-03-31 | 1995-10-17 | Unisys Corporation | Integrated circuit package having a liquid metal-aluminum/copper joint |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2258222A (en) * | 1940-04-27 | 1941-10-07 | Gen Electric | Methyl aryl silicones and insulated conductors and other products utilizing the same |
| NL241492A (https=) * | 1958-07-21 | |||
| US3206647A (en) * | 1960-10-31 | 1965-09-14 | Sprague Electric Co | Semiconductor unit |
| US3414433A (en) * | 1965-07-07 | 1968-12-03 | Westinghouse Electric Corp | Encapsulation of semiconductor |
| US3447975A (en) * | 1965-09-13 | 1969-06-03 | Westinghouse Electric Corp | Bilayer protective coating for exposed p-n junction surfaces |
| US3496427A (en) * | 1966-01-13 | 1970-02-17 | Gen Electric | Semiconductor device with composite encapsulation |
| US3411122A (en) * | 1966-01-13 | 1968-11-12 | Ibm | Electrical resistance element and method of fabricating |
| US3839280A (en) * | 1971-07-28 | 1974-10-01 | Gen Electric | Curable siloxane resin compositions |
| US3792012A (en) * | 1972-03-17 | 1974-02-12 | Gen Electric | Silicone resin useful in molding compositions |
-
1973
- 1973-10-12 JP JP11392873A patent/JPS5336997B2/ja not_active Expired
-
1974
- 1974-10-15 US US05/514,956 patent/US3946427A/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| PLASTICS FOR ELECTRICAL INSULATION=1968US * |
Also Published As
| Publication number | Publication date |
|---|---|
| US3946427A (en) | 1976-03-23 |
| JPS5066171A (https=) | 1975-06-04 |