US4110237A
(en)
*
|
1973-11-19 |
1978-08-29 |
Tokai Denka Kabushiki Kaisha |
Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions
|
JPS5127819A
(en)
*
|
1974-09-02 |
1976-03-09 |
Mitsubishi Gas Chemical Co |
Do oyobi dogokinyokagakushorieki
|
SE400575B
(sv)
*
|
1974-12-13 |
1978-04-03 |
Nordnero Ab |
Bad for betning av koppar och dess legeringar
|
SE400581B
(sv)
*
|
1974-12-13 |
1978-04-03 |
Nordnero Ab |
Bad for kemisk polering av koppar och dess legeringar
|
US4236957A
(en)
*
|
1979-06-25 |
1980-12-02 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant
|
US4233113A
(en)
*
|
1979-06-25 |
1980-11-11 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant
|
US4233112A
(en)
*
|
1979-06-25 |
1980-11-11 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -polysulfide etchant
|
US4233111A
(en)
*
|
1979-06-25 |
1980-11-11 |
Dart Industries Inc. |
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant
|
US4319955A
(en)
*
|
1980-11-05 |
1982-03-16 |
Philip A. Hunt Chemical Corp. |
Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
|
FR2513258A1
(fr)
*
|
1981-09-21 |
1983-03-25 |
Dart Ind Inc |
Solution aqueuse de peroxyde d'hydrogene stabilisee au 3-amino-1,2,4-triazole et son procede de stabilisation
|
US4401509A
(en)
*
|
1982-09-07 |
1983-08-30 |
Fmc Corporation |
Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide
|
US4859281A
(en)
*
|
1987-06-04 |
1989-08-22 |
Pennwalt Corporation |
Etching of copper and copper bearing alloys
|
IT1251431B
(it)
*
|
1991-10-25 |
1995-05-09 |
Costante Fontana |
Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali
|
US5225034A
(en)
*
|
1992-06-04 |
1993-07-06 |
Micron Technology, Inc. |
Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing
|
JPH06287774A
(ja)
*
|
1993-04-05 |
1994-10-11 |
Metsuku Kk |
銅および銅合金の表面処理剤
|
GB9425090D0
(en)
*
|
1994-12-12 |
1995-02-08 |
Alpha Metals Ltd |
Copper coating
|
US5911907A
(en)
*
|
1995-08-30 |
1999-06-15 |
Surface Tek Specialty Products, Inc. |
Composition and method for stripping tin and tin-lead from copper surfaces
|
US5958147A
(en)
*
|
1997-05-05 |
1999-09-28 |
Akzo Nobel N.V. |
Method of treating a metal
|
JPH1129883A
(ja)
*
|
1997-07-08 |
1999-02-02 |
Mec Kk |
銅および銅合金のマイクロエッチング剤
|
US6054061A
(en)
*
|
1997-12-11 |
2000-04-25 |
Shipley Company, L.L.C. |
Composition for circuit board manufacture
|
JP2000064067A
(ja)
|
1998-06-09 |
2000-02-29 |
Ebara Densan Ltd |
エッチング液および銅表面の粗化処理方法
|
US6117250A
(en)
*
|
1999-02-25 |
2000-09-12 |
Morton International Inc. |
Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
|
US6444140B2
(en)
|
1999-03-17 |
2002-09-03 |
Morton International Inc. |
Micro-etch solution for producing metal surface topography
|
US6375693B1
(en)
|
1999-05-07 |
2002-04-23 |
International Business Machines Corporation |
Chemical-mechanical planarization of barriers or liners for copper metallurgy
|
JP4505891B2
(ja)
*
|
1999-09-06 |
2010-07-21 |
Jsr株式会社 |
半導体装置の製造に用いる化学機械研磨用水系分散体
|
US20040099637A1
(en)
*
|
2000-06-16 |
2004-05-27 |
Shipley Company, L.L.C. |
Composition for producing metal surface topography
|
US20030178391A1
(en)
*
|
2000-06-16 |
2003-09-25 |
Shipley Company, L.L.C. |
Composition for producing metal surface topography
|
US6521139B1
(en)
*
|
2000-08-04 |
2003-02-18 |
Shipley Company L.L.C. |
Composition for circuit board manufacture
|
EP1209253A3
(en)
*
|
2000-11-28 |
2004-02-25 |
Shipley Co. L.L.C. |
Process for treating adhesion promoted metal surfaces with epoxy resins
|
US20040161545A1
(en)
*
|
2000-11-28 |
2004-08-19 |
Shipley Company, L.L.C. |
Adhesion method
|
EP1356502A1
(en)
*
|
2001-01-16 |
2003-10-29 |
Cabot Microelectronics Corporation |
Ammonium oxalate-containing polishing system and method
|
US6746547B2
(en)
|
2002-03-05 |
2004-06-08 |
Rd Chemical Company |
Methods and compositions for oxide production on copper
|
US7300601B2
(en)
*
|
2002-12-10 |
2007-11-27 |
Advanced Technology Materials, Inc. |
Passivative chemical mechanical polishing composition for copper film planarization
|
JP4090951B2
(ja)
*
|
2003-06-26 |
2008-05-28 |
株式会社荏原電産 |
銅及び銅合金の鏡面仕上げエッチング液
|
US6969638B2
(en)
*
|
2003-06-27 |
2005-11-29 |
Texas Instruments Incorporated |
Low cost substrate for an integrated circuit device with bondpads free of plated gold
|
US7232478B2
(en)
*
|
2003-07-14 |
2007-06-19 |
Enthone Inc. |
Adhesion promotion in printed circuit boards
|
US20050097825A1
(en)
*
|
2003-11-06 |
2005-05-12 |
Jinru Bian |
Compositions and methods for a barrier removal
|
US20060000808A1
(en)
*
|
2004-07-01 |
2006-01-05 |
Fuji Photo Film Co., Ltd. |
Polishing solution of metal and chemical mechanical polishing method
|
JP2006179845A
(ja)
|
2004-11-26 |
2006-07-06 |
Fuji Photo Film Co Ltd |
金属用研磨液及び研磨方法
|
JP2007088379A
(ja)
|
2005-09-26 |
2007-04-05 |
Fujifilm Corp |
水系研磨液、及び、化学機械的研磨方法
|
TW200734436A
(en)
|
2006-01-30 |
2007-09-16 |
Fujifilm Corp |
Metal-polishing liquid and chemical mechanical polishing method using the same
|
JP2007214518A
(ja)
|
2006-02-13 |
2007-08-23 |
Fujifilm Corp |
金属用研磨液
|
KR20070088245A
(ko)
*
|
2006-02-24 |
2007-08-29 |
후지필름 가부시키가이샤 |
금속용 연마액
|
US7902072B2
(en)
|
2006-02-28 |
2011-03-08 |
Fujifilm Corporation |
Metal-polishing composition and chemical-mechanical polishing method
|
JP4990543B2
(ja)
*
|
2006-03-23 |
2012-08-01 |
富士フイルム株式会社 |
金属用研磨液
|
JP2008181955A
(ja)
*
|
2007-01-23 |
2008-08-07 |
Fujifilm Corp |
金属用研磨液及びそれを用いた研磨方法
|
CN101636465A
(zh)
*
|
2007-01-31 |
2010-01-27 |
高级技术材料公司 |
用于化学机械抛光浆料应用的聚合物-二氧化硅分散剂的稳定化
|
US9202709B2
(en)
|
2008-03-19 |
2015-12-01 |
Fujifilm Corporation |
Polishing liquid for metal and polishing method using the same
|
JP5202258B2
(ja)
|
2008-03-25 |
2013-06-05 |
富士フイルム株式会社 |
金属研磨用組成物、及び化学的機械的研磨方法
|
JP2011179085A
(ja)
*
|
2010-03-02 |
2011-09-15 |
C Uyemura & Co Ltd |
電気めっき用前処理剤、電気めっきの前処理方法及び電気めっき方法
|