JPS5322535B2 - - Google Patents
Info
- Publication number
- JPS5322535B2 JPS5322535B2 JP12684973A JP12684973A JPS5322535B2 JP S5322535 B2 JPS5322535 B2 JP S5322535B2 JP 12684973 A JP12684973 A JP 12684973A JP 12684973 A JP12684973 A JP 12684973A JP S5322535 B2 JPS5322535 B2 JP S5322535B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0661—Oscillating baths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49995—Shaping one-piece blank by removing material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating With Molten Metal (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31407972A | 1972-12-11 | 1972-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4989653A JPS4989653A (US08124630-20120228-C00152.png) | 1974-08-27 |
| JPS5322535B2 true JPS5322535B2 (US08124630-20120228-C00152.png) | 1978-07-10 |
Family
ID=23218468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12684973A Expired JPS5322535B2 (US08124630-20120228-C00152.png) | 1972-12-11 | 1973-11-13 |
Country Status (7)
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3924794A (en) * | 1973-08-14 | 1975-12-09 | Us Energy | Solder leveling process |
| US4083323A (en) * | 1975-08-07 | 1978-04-11 | Xerox Corporation | Pneumatic system for solder leveling apparatus |
| US4116766A (en) * | 1976-08-31 | 1978-09-26 | The United States Of America As Represented By The Department Of Energy | Ultrasonic dip seal maintenance system |
| DE2911403A1 (de) * | 1979-03-23 | 1980-09-25 | Kabel Metallwerke Ghh | Verfahren und vorrichtung zur herstellung laengsnahtgeschweisster rohre aus metallen |
| CH656769A5 (de) * | 1980-09-09 | 1986-07-15 | Sinter Ltd | Vorrichtung zum aufbringen von lot auf leiterplatten. |
| CH651484A5 (de) * | 1981-06-24 | 1985-09-30 | Roag Ag | Verfahren und vorrichtung zum trennen von optikteilen von tragkoerpern. |
| US4619841A (en) * | 1982-09-13 | 1986-10-28 | Schwerin Thomas E | Solder leveler |
| GB2154038A (en) * | 1984-02-08 | 1985-08-29 | Elm Ltd | Detecting fan failure in cooled food stores |
| JPS61238464A (ja) * | 1985-04-13 | 1986-10-23 | Eiichi Miyake | 物品加熱装置 |
| US4769083A (en) * | 1986-01-27 | 1988-09-06 | Gould Inc. | Method for removing excess solder from printed circuit boards |
| GB8613104D0 (en) * | 1986-05-29 | 1986-07-02 | Lymn P P A | Solder leveller |
| DE3765359D1 (de) * | 1986-08-13 | 1990-11-08 | Senju Metal Industry Co | Loetgeraet des springbrunnentyps. |
| US4930898A (en) * | 1988-06-27 | 1990-06-05 | The United States Of America As Represented By The Secretary Of Agriculture | Process and apparatus for direct ultrasonic mixing prior to analysis |
| US5344064A (en) * | 1993-08-06 | 1994-09-06 | Stokes Dyrell K | Method for unsoldering heat exchanger end tank from core header plate |
| FR2725925B1 (fr) * | 1994-10-24 | 1998-02-27 | Coudert Anne Marie France | Procede de nettoyage et decapage des surfaces par ultrasons par application d'une sonde |
| US6202658B1 (en) | 1998-11-11 | 2001-03-20 | Applied Materials, Inc. | Method and apparatus for cleaning the edge of a thin disc |
| US6311702B1 (en) * | 1998-11-11 | 2001-11-06 | Applied Materials, Inc. | Megasonic cleaner |
| DE19903957B4 (de) * | 1999-01-25 | 2008-05-21 | Finetech Gmbh & Co.Kg | Verfahren und Vorrichtung zum Entfernen von Lot |
| JP3799200B2 (ja) * | 1999-09-22 | 2006-07-19 | キヤノン株式会社 | はんだ回収方法およびはんだ回収装置 |
| GB0207207D0 (en) | 2002-03-27 | 2002-05-08 | Smith Simon L | Activity and behavioural monitor and alarm device |
| TWI340677B (en) * | 2008-06-06 | 2011-04-21 | Ind Tech Res Inst | Scrap removal method and apparatus |
| DE102013100473A1 (de) * | 2013-01-17 | 2014-07-17 | Seho Systemtechnik Gmbh | Verfahren und Vorrichtung zum Reinigen einer Lötdüse |
| WO2016022755A2 (en) | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| CN108890541B (zh) * | 2018-06-04 | 2020-09-25 | 江苏大学 | 一种人工淹没式空化射流微零件塑性成形的装置及方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB969546A (en) * | 1962-01-02 | 1964-09-09 | Rolls Royce | Improvements in or relating to methods and apparatus for removing burrs or the like from workpieces |
| US3210182A (en) * | 1962-08-13 | 1965-10-05 | Ibm | Selective removal of excess solder |
| GB1004225A (en) * | 1963-03-27 | 1965-09-15 | Electrovert Mfg Co Ltd | Apparatus for processing with a liquid |
| US3249281A (en) * | 1964-01-13 | 1966-05-03 | Sanders Associates Inc | Multiple ultrasonic solder fountain machine |
| US3498303A (en) * | 1966-03-17 | 1970-03-03 | Hewlett Packard Co | Apparatus for washing and drying printed circuit boards |
| US3491779A (en) * | 1967-07-06 | 1970-01-27 | Brown Eng Co Inc | Solder leveling apparatus |
| US3603329A (en) * | 1968-11-06 | 1971-09-07 | Brown Eng Co Inc | Apparatus for manufacturing printed circuits |
-
1972
- 1972-12-11 US US00314079A patent/US3795358A/en not_active Expired - Lifetime
-
1973
- 1973-10-23 FR FR7338740A patent/FR2209636B1/fr not_active Expired
- 1973-11-09 CA CA185,430A patent/CA1002815A/en not_active Expired
- 1973-11-13 JP JP12684973A patent/JPS5322535B2/ja not_active Expired
- 1973-11-19 GB GB5356373A patent/GB1446568A/en not_active Expired
- 1973-11-21 DE DE2357950A patent/DE2357950A1/de active Pending
- 1973-12-04 IT IT41032/73A patent/IT1001112B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| GB1446568A (en) | 1976-08-18 |
| CA1002815A (en) | 1977-01-04 |
| DE2357950A1 (de) | 1974-06-12 |
| FR2209636B1 (US08124630-20120228-C00152.png) | 1976-10-01 |
| JPS4989653A (US08124630-20120228-C00152.png) | 1974-08-27 |
| US3795358A (en) | 1974-03-05 |
| FR2209636A1 (US08124630-20120228-C00152.png) | 1974-07-05 |
| IT1001112B (it) | 1976-04-20 |
