IT1001112B - Apparecchiatura e procedimento per livellare lo spessore di una lega di saldatura ad esempio di pannelli circuitali stampati - Google Patents

Apparecchiatura e procedimento per livellare lo spessore di una lega di saldatura ad esempio di pannelli circuitali stampati

Info

Publication number
IT1001112B
IT1001112B IT41032/73A IT4103273A IT1001112B IT 1001112 B IT1001112 B IT 1001112B IT 41032/73 A IT41032/73 A IT 41032/73A IT 4103273 A IT4103273 A IT 4103273A IT 1001112 B IT1001112 B IT 1001112B
Authority
IT
Italy
Prior art keywords
leveling
procedure
thickness
equipment
molded circuit
Prior art date
Application number
IT41032/73A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1001112B publication Critical patent/IT1001112B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0661—Oscillating baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49995—Shaping one-piece blank by removing material
IT41032/73A 1972-12-11 1973-12-04 Apparecchiatura e procedimento per livellare lo spessore di una lega di saldatura ad esempio di pannelli circuitali stampati IT1001112B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31407972A 1972-12-11 1972-12-11

Publications (1)

Publication Number Publication Date
IT1001112B true IT1001112B (it) 1976-04-20

Family

ID=23218468

Family Applications (1)

Application Number Title Priority Date Filing Date
IT41032/73A IT1001112B (it) 1972-12-11 1973-12-04 Apparecchiatura e procedimento per livellare lo spessore di una lega di saldatura ad esempio di pannelli circuitali stampati

Country Status (7)

Country Link
US (1) US3795358A (it)
JP (1) JPS5322535B2 (it)
CA (1) CA1002815A (it)
DE (1) DE2357950A1 (it)
FR (1) FR2209636B1 (it)
GB (1) GB1446568A (it)
IT (1) IT1001112B (it)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3924794A (en) * 1973-08-14 1975-12-09 Us Energy Solder leveling process
US4083323A (en) * 1975-08-07 1978-04-11 Xerox Corporation Pneumatic system for solder leveling apparatus
US4116766A (en) * 1976-08-31 1978-09-26 The United States Of America As Represented By The Department Of Energy Ultrasonic dip seal maintenance system
DE2911403A1 (de) * 1979-03-23 1980-09-25 Kabel Metallwerke Ghh Verfahren und vorrichtung zur herstellung laengsnahtgeschweisster rohre aus metallen
CH656769A5 (de) * 1980-09-09 1986-07-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
CH651484A5 (de) * 1981-06-24 1985-09-30 Roag Ag Verfahren und vorrichtung zum trennen von optikteilen von tragkoerpern.
US4619841A (en) * 1982-09-13 1986-10-28 Schwerin Thomas E Solder leveler
GB2154038A (en) * 1984-02-08 1985-08-29 Elm Ltd Detecting fan failure in cooled food stores
JPS61238464A (ja) * 1985-04-13 1986-10-23 Eiichi Miyake 物品加熱装置
US4769083A (en) * 1986-01-27 1988-09-06 Gould Inc. Method for removing excess solder from printed circuit boards
GB8613104D0 (en) * 1986-05-29 1986-07-02 Lymn P P A Solder leveller
DE3765359D1 (de) * 1986-08-13 1990-11-08 Senju Metal Industry Co Loetgeraet des springbrunnentyps.
US4930898A (en) * 1988-06-27 1990-06-05 The United States Of America As Represented By The Secretary Of Agriculture Process and apparatus for direct ultrasonic mixing prior to analysis
US5344064A (en) * 1993-08-06 1994-09-06 Stokes Dyrell K Method for unsoldering heat exchanger end tank from core header plate
FR2725925B1 (fr) * 1994-10-24 1998-02-27 Coudert Anne Marie France Procede de nettoyage et decapage des surfaces par ultrasons par application d'une sonde
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6311702B1 (en) * 1998-11-11 2001-11-06 Applied Materials, Inc. Megasonic cleaner
DE19903957B4 (de) * 1999-01-25 2008-05-21 Finetech Gmbh & Co.Kg Verfahren und Vorrichtung zum Entfernen von Lot
JP3799200B2 (ja) * 1999-09-22 2006-07-19 キヤノン株式会社 はんだ回収方法およびはんだ回収装置
GB0207207D0 (en) 2002-03-27 2002-05-08 Smith Simon L Activity and behavioural monitor and alarm device
TWI340677B (en) 2008-06-06 2011-04-21 Ind Tech Res Inst Scrap removal method and apparatus
DE102013100473A1 (de) * 2013-01-17 2014-07-17 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Reinigen einer Lötdüse
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN108890541B (zh) * 2018-06-04 2020-09-25 江苏大学 一种人工淹没式空化射流微零件塑性成形的装置及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB969546A (en) * 1962-01-02 1964-09-09 Rolls Royce Improvements in or relating to methods and apparatus for removing burrs or the like from workpieces
US3210182A (en) * 1962-08-13 1965-10-05 Ibm Selective removal of excess solder
GB1004225A (en) * 1963-03-27 1965-09-15 Electrovert Mfg Co Ltd Apparatus for processing with a liquid
US3249281A (en) * 1964-01-13 1966-05-03 Sanders Associates Inc Multiple ultrasonic solder fountain machine
US3498303A (en) * 1966-03-17 1970-03-03 Hewlett Packard Co Apparatus for washing and drying printed circuit boards
US3491779A (en) * 1967-07-06 1970-01-27 Brown Eng Co Inc Solder leveling apparatus
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits

Also Published As

Publication number Publication date
CA1002815A (en) 1977-01-04
US3795358A (en) 1974-03-05
FR2209636A1 (it) 1974-07-05
JPS4989653A (it) 1974-08-27
DE2357950A1 (de) 1974-06-12
JPS5322535B2 (it) 1978-07-10
GB1446568A (en) 1976-08-18
FR2209636B1 (it) 1976-10-01

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