JPS5319147A - Plating device for semiconductor wafer - Google Patents

Plating device for semiconductor wafer

Info

Publication number
JPS5319147A
JPS5319147A JP9416976A JP9416976A JPS5319147A JP S5319147 A JPS5319147 A JP S5319147A JP 9416976 A JP9416976 A JP 9416976A JP 9416976 A JP9416976 A JP 9416976A JP S5319147 A JPS5319147 A JP S5319147A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
plating device
plating
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9416976A
Other languages
English (en)
Japanese (ja)
Other versions
JPS565318B2 (enrdf_load_stackoverflow
Inventor
Seiichirou Sougou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJI ADOBANSU KK
Original Assignee
FUJI ADOBANSU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJI ADOBANSU KK filed Critical FUJI ADOBANSU KK
Priority to JP9416976A priority Critical patent/JPS5319147A/ja
Publication of JPS5319147A publication Critical patent/JPS5319147A/ja
Publication of JPS565318B2 publication Critical patent/JPS565318B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP9416976A 1976-08-07 1976-08-07 Plating device for semiconductor wafer Granted JPS5319147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9416976A JPS5319147A (en) 1976-08-07 1976-08-07 Plating device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9416976A JPS5319147A (en) 1976-08-07 1976-08-07 Plating device for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS5319147A true JPS5319147A (en) 1978-02-22
JPS565318B2 JPS565318B2 (enrdf_load_stackoverflow) 1981-02-04

Family

ID=14102840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9416976A Granted JPS5319147A (en) 1976-08-07 1976-08-07 Plating device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5319147A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347556A (ja) * 1986-08-13 1988-02-29 Honda Motor Co Ltd Ｘ形リンク装置
US4906341A (en) * 1987-09-24 1990-03-06 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device and apparatus therefor
JPH02122067U (enrdf_load_stackoverflow) * 1989-03-20 1990-10-04
JPH0625899A (ja) * 1992-07-10 1994-02-01 Nec Corp 電解メッキ装置
US5887482A (en) * 1995-01-13 1999-03-30 Yoshiki Industrial Co., Ltd. Apparatus for mutual conversion between circular motion and reciprocal motion

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831454A (enrdf_load_stackoverflow) * 1971-08-17 1973-04-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831454A (enrdf_load_stackoverflow) * 1971-08-17 1973-04-25

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347556A (ja) * 1986-08-13 1988-02-29 Honda Motor Co Ltd Ｘ形リンク装置
US4906341A (en) * 1987-09-24 1990-03-06 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device and apparatus therefor
JPH02122067U (enrdf_load_stackoverflow) * 1989-03-20 1990-10-04
JPH0625899A (ja) * 1992-07-10 1994-02-01 Nec Corp 電解メッキ装置
US5443707A (en) * 1992-07-10 1995-08-22 Nec Corporation Apparatus for electroplating the main surface of a substrate
US5887482A (en) * 1995-01-13 1999-03-30 Yoshiki Industrial Co., Ltd. Apparatus for mutual conversion between circular motion and reciprocal motion

Also Published As

Publication number Publication date
JPS565318B2 (enrdf_load_stackoverflow) 1981-02-04

Similar Documents

Publication Publication Date Title
JPS52117564A (en) Device for treating computerrcontrolled semiconductor wafer
JPS53108763A (en) Device for polishing semiconductor wafer
JPS5320774A (en) Semiconductor device
JPS535965A (en) Semiconductor device
JPS5298483A (en) Semiconductor device
JPS5342580A (en) Semiconductor device
JPS5297689A (en) Semiconductor device
JPS52138880A (en) Selffprotecting semiconductor device
JPS5323531A (en) Semiconductor device
JPS52129378A (en) Semiconductor device
JPS52110575A (en) Threeeterminal semiconductor device
JPS5327370A (en) Semiconductor device
JPS5343483A (en) Semiconductor device
GB2007495B (en) Carrier for semiconductor wafers
JPS5329078A (en) Semiconductor device
JPS52150985A (en) Semiconductor device
GB1538650A (en) Semiconductor device
JPS52142231A (en) Semiconductor circuits device
JPS5319147A (en) Plating device for semiconductor wafer
JPS5310267A (en) Semiconductor device
YU39405B (en) Semiconductor device
JPS5390871A (en) Device for chucking semiconductor wafer
JPS5354490A (en) Semiconductor device
JPS52147072A (en) Semiconductor device
JPS5332368A (en) Semiconductor device case