JPS53142869A - Method of bonding lead frame to heat dissipating plate - Google Patents

Method of bonding lead frame to heat dissipating plate

Info

Publication number
JPS53142869A
JPS53142869A JP5791077A JP5791077A JPS53142869A JP S53142869 A JPS53142869 A JP S53142869A JP 5791077 A JP5791077 A JP 5791077A JP 5791077 A JP5791077 A JP 5791077A JP S53142869 A JPS53142869 A JP S53142869A
Authority
JP
Japan
Prior art keywords
lead frame
heat dissipating
dissipating plate
bonding lead
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5791077A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5742224B2 (enrdf_load_stackoverflow
Inventor
Minoru Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Machinery Inc
Original Assignee
Nichiden Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiden Machinery Ltd filed Critical Nichiden Machinery Ltd
Priority to JP5791077A priority Critical patent/JPS53142869A/ja
Publication of JPS53142869A publication Critical patent/JPS53142869A/ja
Publication of JPS5742224B2 publication Critical patent/JPS5742224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP5791077A 1977-05-18 1977-05-18 Method of bonding lead frame to heat dissipating plate Granted JPS53142869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5791077A JPS53142869A (en) 1977-05-18 1977-05-18 Method of bonding lead frame to heat dissipating plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5791077A JPS53142869A (en) 1977-05-18 1977-05-18 Method of bonding lead frame to heat dissipating plate

Publications (2)

Publication Number Publication Date
JPS53142869A true JPS53142869A (en) 1978-12-12
JPS5742224B2 JPS5742224B2 (enrdf_load_stackoverflow) 1982-09-07

Family

ID=13069135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5791077A Granted JPS53142869A (en) 1977-05-18 1977-05-18 Method of bonding lead frame to heat dissipating plate

Country Status (1)

Country Link
JP (1) JPS53142869A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102693953A (zh) * 2011-03-22 2012-09-26 株式会社东芝 半导体装置及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57172933U (enrdf_load_stackoverflow) * 1981-04-28 1982-10-30
JPS5952227U (ja) * 1982-09-29 1984-04-06 神鋼電機株式会社 電磁クラツチ
JPS62141931U (enrdf_load_stackoverflow) * 1986-02-28 1987-09-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102693953A (zh) * 2011-03-22 2012-09-26 株式会社东芝 半导体装置及其制造方法
JP2012199436A (ja) * 2011-03-22 2012-10-18 Toshiba Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS5742224B2 (enrdf_load_stackoverflow) 1982-09-07

Similar Documents

Publication Publication Date Title
JPS5499762A (en) Production of aluminium soldered plate
JPS5499761A (en) Production of aluminium soldered plate
JPS53146572A (en) Method of bonding disks
JPS546774A (en) Heat conduction cooling module
JPS53107287A (en) Method of producing semiconductor
JPS53142869A (en) Method of bonding lead frame to heat dissipating plate
JPS5771195A (en) Heat dissipating device irrespective of potential
JPS5490221A (en) Heat treatment of glass plate
JPS5527272A (en) Method of producing heat shielding metal face plate
JPS5450271A (en) Device for dissipating heat of electronic unit subassembly
JPS5760852A (en) Method of producing semiconductor device
JPS53128275A (en) Semiconductor packaging lead frame and method of producing same and mask plate for producing same
JPS53110149A (en) Method of fabricating aluminum alloyymade heat exchanger
JPS53131764A (en) Method of producing compound semiconductor
JPS5488518A (en) Method of bonding lace to automobile
JPS5394422A (en) Method of directly bonding plate to concrete structure
JPS5486575A (en) Method of bonding resinncoated metal plate
JPS5395578A (en) Method of producing ceramic package by heat pressing
JPS5286949A (en) Brazing method of aluminium hot plate
JPS53123079A (en) Method of producing semiconductor lead frame
JPS5383469A (en) Method of producing heat dissipating plate semiconductor
JPS53122228A (en) Method of mounting window plate to frame
JPS53148388A (en) Method of producing compound semiconductor crystal
JPS5439571A (en) Method of producing compound semiconductor
JPS53119943A (en) Method of improving bonding of filler particle to polymer matrix