JPS5742224B2 - - Google Patents
Info
- Publication number
- JPS5742224B2 JPS5742224B2 JP5791077A JP5791077A JPS5742224B2 JP S5742224 B2 JPS5742224 B2 JP S5742224B2 JP 5791077 A JP5791077 A JP 5791077A JP 5791077 A JP5791077 A JP 5791077A JP S5742224 B2 JPS5742224 B2 JP S5742224B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5791077A JPS53142869A (en) | 1977-05-18 | 1977-05-18 | Method of bonding lead frame to heat dissipating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5791077A JPS53142869A (en) | 1977-05-18 | 1977-05-18 | Method of bonding lead frame to heat dissipating plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53142869A JPS53142869A (en) | 1978-12-12 |
| JPS5742224B2 true JPS5742224B2 (enrdf_load_stackoverflow) | 1982-09-07 |
Family
ID=13069135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5791077A Granted JPS53142869A (en) | 1977-05-18 | 1977-05-18 | Method of bonding lead frame to heat dissipating plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53142869A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57172933U (enrdf_load_stackoverflow) * | 1981-04-28 | 1982-10-30 | ||
| JPS5952227U (ja) * | 1982-09-29 | 1984-04-06 | 神鋼電機株式会社 | 電磁クラツチ |
| JPS62141931U (enrdf_load_stackoverflow) * | 1986-02-28 | 1987-09-08 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012199436A (ja) * | 2011-03-22 | 2012-10-18 | Toshiba Corp | 半導体装置及びその製造方法 |
-
1977
- 1977-05-18 JP JP5791077A patent/JPS53142869A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57172933U (enrdf_load_stackoverflow) * | 1981-04-28 | 1982-10-30 | ||
| JPS5952227U (ja) * | 1982-09-29 | 1984-04-06 | 神鋼電機株式会社 | 電磁クラツチ |
| JPS62141931U (enrdf_load_stackoverflow) * | 1986-02-28 | 1987-09-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53142869A (en) | 1978-12-12 |